Optimization design on process parameters of copper wire bonding for power modules
In order to improve the copper wire bonding performance of the power modules, an optimization design scheme of process parameters for copper wire bonding was proposed by using the six-factor five-level orthogonal test method, and combining the back propagation (BP) neural network and genetic algorit...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-03-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.02.104 |
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