Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers
Wafer bonding describes all technologies for joining two or more substrates directly or using certain intermediate layers. Current investigations are focused on so-called low temperature bonding as a special direct bonding technology. It is carried out without intermediate layers and at temperatures...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Gruppo Italiano Frattura
2011-01-01
|
| Series: | Fracture and Structural Integrity |
| Subjects: | |
| Online Access: | http://www.gruppofrattura.it/pdf/rivista/numero15/numero_15_art_3.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|