Monolithic 3-D-Based Nonvolatile Associative Processor for High-Performance Energy-Efficient Computations

This article presents a monolithic 3-D associative in-memory processor (M3D AP) that combines emerging nonvolatile (NV) magnetic tunnel junction (MTJ) technology with massively parallel associative in-memory processing and M3D integration. The proposed architecture features two monolithic layers, wi...

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Bibliographic Details
Main Authors: Esteban Garzon, Alessandro Bedoya, Marco Lanuzza, Leonid Yavits
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10649641/
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