Energy-efficient 3D multi-band I/O interface for enhanced mobile memory communication

Energy-efficient 3D multi-band I/O interface for enhanced mobile memory communication

This article develops an energy-efficient 3D multi-band I/O interface to meet the demand for high computation and improve battery life for future mobile memory interfaces exploiting 3D integration. The proposed multi-band I/O (MBI) interface utilizes 3D integration, for two radio frequency band tran...

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Bibliographic Details
Main Author: Ahmed Alzahmi
Format: Article
Language:English
Published: Taylor & Francis Group 2025-01-01
Series:Automatika
Subjects:
RF band
multi-band
baseband
I/O interfeace
three-dimensional (3D)
memory
Online Access:https://www.tandfonline.com/doi/10.1080/00051144.2024.2444758
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https://www.tandfonline.com/doi/10.1080/00051144.2024.2444758

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