AgIn2 thickness on void rate, microstructure, IMC growth, thermal and mechanical properties of fluxless In@AgIn2 joint
Indium (In) has been extensively used as a thermal interface material (TIM1) between the die and lid in high-power central processing units (CPUs) to enhance heat dissipation. However, organic flux residues trapped within the In solder during indium reflow process can outgas during subsequent solder...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425000985 |
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