Improving bonding strength of W/Cu dual metal interface through laser micro-structuring method
Selective laser melting (SLM) is a promising technology for fabricating complex components with W/Cu dual metal. To enhance the interfacial bonding of W/Cu dual metal, we propose a novel approach using laser texturing to fabricate micro/nanostructures on the W surface. The micro/nanostructures promo...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Light Publishing Group
2024-09-01
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| Series: | Light: Advanced Manufacturing |
| Subjects: | |
| Online Access: | https://www.light-am.com/article/doi/10.37188/lam.2024.033 |
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