Melus, T., Kolenak, R., Drapala, J., Sloboda, M., Gogola, P., & Pasak, M. Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance. AIMS Press.
Chicago Style (17th ed.) CitationMelus, Tomas, Roman Kolenak, Jaromir Drapala, Mikulas Sloboda, Peter Gogola, and Matej Pasak. Research of Joining the SiC and Cu Combination by Use of SnTi Solder Filled with SiC Nanoparticles and with Active Ultrasound Assistance. AIMS Press.
MLA (9th ed.) CitationMelus, Tomas, et al. Research of Joining the SiC and Cu Combination by Use of SnTi Solder Filled with SiC Nanoparticles and with Active Ultrasound Assistance. AIMS Press.
Warning: These citations may not always be 100% accurate.