Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance
The aim of this study was to characterize a Sn-Ti solder alloy containing 6 wt.% SiC nanoparticles and evaluate its use for direct soldering of SiC ceramics to a copper (Cu) substrate. Soldering was performed with direct ultrasound activation. The average tensile strength of the solder alloy was 17....
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIMS Press
2024-10-01
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| Series: | AIMS Materials Science |
| Subjects: | |
| Online Access: | https://www.aimspress.com/article/doi/10.3934/matersci.2024048 |
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