STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE
The chip component no-fillet solder joints finite element analysis models were set up. The influences of pad length,pad width,solder joint volume and solder joint material on the stress and strain distribution on no-fillet solder joints were analyzed under the thermal cyclic loading. The results sho...
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2016-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.04.029 |
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