Scalable and Fast Electrical Modeling Method for Bonding-Wire Memory Packages

Scalable and Fast Electrical Modeling Method for Bonding-Wire Memory Packages

With the increasing demand for high-speed and cost-effective memory solutions, bonding wire (BW)-based memory packages are adopted in various applications. Designing BW based memory packages requires numerous changes in design parameters of multiple components. However, using traditional 3D electrom...

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Bibliographic Details
Main Authors: Dongryul Park, Seonghi Lee, Seunghun Ryu, Hyunwoo Kim, Duksoo Kim, Hyunsik Kim, Jongwook Kim, Seungyoung Ahn
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Access
Subjects:
Electrical modeling
memory system
signal integrity
Online Access:https://ieeexplore.ieee.org/document/11071706/
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https://ieeexplore.ieee.org/document/11071706/

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