RESEARCH ON HEAT DISSIPATION OF LTCC SUBSTRATE MICROCHANNEL BASED ON ORTHOGONAL DESIGN
The establishment of micro channel LTCC（Low-temperature cofired ceramics, LTCC） substrate finite element analysis model of multi chip module and the thermal simulation analysis on it. The effect of different microchannel structures, microchannel diameter and fluid flow velocity on the heat dissipati...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2019-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2019.05.033 |
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