Highly Thermally Conductive Liquid Crystalline Epoxy Resin Vitrimers with Reconfigurable, Shape‐Memory, Photo‐Thermal, and Closed‐Loop Recycling Performance
Abstract The low thermal conductivity, poor toughness, and non‐reprocessability of thermosetting epoxy resins severely restrict their applications and sustainable development in flexible electronics. Herein, liquid crystalline epoxy (LCE) and dynamic ester and disulfide bonds are introduced into the...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2025-01-01
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| Series: | Advanced Science |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/advs.202410362 |
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