Critical review of ultra-lightweight foam materials

Ultra-lightweight foam (ULF) materials have emerged as transformative solutions across many industries, driven by the increasing demand for lightweight yet high-performance materials. Characterized by their low density, high porosity, and remarkable thermal insulation properties, including exception...

Full description

Saved in:
Bibliographic Details
Main Authors: Ridhi Saini, Dipen Kumar Rajak, Tilak Joshi, Dwesh Kumar Singh, Venkat A.N. Chilla, Sriram Sathaiah
Format: Article
Language:English
Published: Elsevier 2025-01-01
Series:Next Nanotechnology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2949829525000075
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Ultra-lightweight foam (ULF) materials have emerged as transformative solutions across many industries, driven by the increasing demand for lightweight yet high-performance materials. Characterized by their low density, high porosity, and remarkable thermal insulation properties, including exceptional cushioning and shock absorption capabilities. These attributes make them essential in the aerospace, automotive, medical, and construction sectors, where efficiency and performance are paramount. Current trends in ULF materials highlight a strong commitment to sustainability by utilizing bio-based resources and recycled materials. The ULF materials revolutionize various industries by providing lightweight solutions, contributing to energy savings and reducing environmental impact. As industries increasingly prioritize sustainability and performance, ULF materials stand at the forefront of material science innovation, promising a future marked by enhanced efficiency and environmental responsibility. This review explores the classifications, manufacturing techniques, properties, applications, advantages, and challenges associated with ULF materials. This exploration aims to lighten the enormous possibilities that ULF materials present in achieving a more sustainable and high-performance future across diverse applications.
ISSN:2949-8295