Wide‐Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction

Wide‐Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction

Abstract Heterogeneous integration of microelectronic components provides a pathway to improve circuit/component performance; however, this comes with assembly challenges, in particular due to complex interfaces via subsurface bump bonds. The ability of these bonds to transmit electrical signals and...

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Bibliographic Details
Main Authors: Amun Jarzembski, Siddharth Nair, Wyatt Hodges, Matthew Jordan, Anthony McDonald, Logan Antiporda, Greg W. Pickrell, Timothy Walsh, Fabio Semperlotti, Jason Neely, Luke Yates
Format: Article
Language:English
Published: Wiley-VCH 2025-07-01
Series:Advanced Materials Interfaces
Subjects:
deep neural network (DNN)
FDTR
heterogeneous integration
subsurface imaging
thermal boundary conductance
Online Access:https://doi.org/10.1002/admi.202401039
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https://doi.org/10.1002/admi.202401039

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