Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging

Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging

Semiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the open surface of an IC chip in flip-chip packaging and explores the points of information leakage over the enti...

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Bibliographic Details
Main Authors: Makoto Nagata, Takuji Miki
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Open Journal of the Solid-State Circuits Society
Subjects:
Advanced packaging
cryptography
hardware security
integrated circuits (ICs)
secure packaging
side channel (SC) attack
Online Access:https://ieeexplore.ieee.org/document/10755152/
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