A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles

A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles

Highlights A bio-inspired dual-amplified patch (MN@EV/SC) was fabricated by integrating extracellular vesicle-loaded microneedles with a soft suction chamber for effective transdermal delivery. The MN@EV/SC system achieved an exceptional penetration depth of 290 μm, while minimizing plasma corticost...

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Bibliographic Details
Main Authors: Minwoo Song, Minji Ha, Sol Shin, Minjin Kim, Soyoung Son, Jihyun Lee, Gui Won Hwang, Jeongyun Kim, Van Hieu Duong, Jae Hyung Park, Changhyun Pang
Format: Article
Language:English
Published: SpringerOpen 2025-07-01
Series:Nano-Micro Letters
Subjects:
Biomimetics
Cupping
Microneedle
Transdermal patch
Extracellular vesicles
Online Access:https://doi.org/10.1007/s40820-025-01853-7
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https://doi.org/10.1007/s40820-025-01853-7

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