Study on the Stress and Warpage of Flip Chip Package Under Current Crowding
In order to study the influence of current accumulation on flip chip packaging a three-dimensional package model of flip chip is built and the electro-thermal and thermal-structure couplings are analyzed with finite element technique to obtain the temperature distribution stress distribution and dis...
Saved in:
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Editorial Department of Journal of Nantong University (Natural Science Edition)
2020-12-01
|
| Series: | Nantong Daxue xuebao. Ziran kexue ban |
| Subjects: | |
| Online Access: | https://ngzke.cbpt.cnki.net/portal/journal/portal/client/paper/50ad9cf4d19ff041a558ad3e20bfc69b |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|