Sol-Gel Deposited Porogen Based Porous Low-k Thin Films for Interlayer Dielectric Application in ULSI Circuits

Porous SiO2 low-k thin films with low dielectric constant were successfully deposited by sol-gel spin-coating technique. The films were deposited by using Tertaethylorthosilicate (TEOS) as a precursor solution and HF was used as an acid catalyst solution. The Tween80 with different volumetric concen...

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Bibliographic Details
Main Authors: Yogesh S. Mhaisagar, A.M. Mahajan
Format: Article
Language:English
Published: Sumy State University 2012-10-01
Series:Журнал нано- та електронної фізики
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Online Access:http://jnep.sumdu.edu.ua/download/numbers/2012/3/articles/jnep_2012_V4_03002.pdf
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