Effects of High-Density Pulse Currents on the Solidification Structures of Cu-SiCp/AZ91D Composites
In this study, Cu-SiCp/AZ91D composites were prepared with high-density pulse currents. The wettability between SiCp and matrix during solidification was improved by coating 0.095-μm thick copper film on the surface of SiCp. By comparing the composites prepared with/without pulse currents, the solid...
Saved in:
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2019-01-01
|
| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2019/1684580 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | In this study, Cu-SiCp/AZ91D composites were prepared with high-density pulse currents. The wettability between SiCp and matrix during solidification was improved by coating 0.095-μm thick copper film on the surface of SiCp. By comparing the composites prepared with/without pulse currents, the solidification structure and its formation mechanism of Cu-SiCp/AZ91D composites were analyzed under different conditions. The Cu-SiCp/AZ91D composites prepared without high-density pulse currents were mainly composed of α-Mg, β-Mg17Al12, and a small amount of Mg2Si phases, with coarse grains and uneven structures. Under the action of high-density pulse currents, the structures of Cu-SiCp/AZ91D composites were transformed into α-Mg and Mg2Si phases with refined grain, and the homogeneity of the structures was improved significantly. |
|---|---|
| ISSN: | 1687-8434 1687-8442 |