Li, G., Dai, X., Zhang, Y., Song, L., Yu, P., Xiang, M., . . . Guo, W. A Novel Hybrid Photonic Integration Scheme Based on Flip-Chip Bonding Combined With Vertical Coupling. IEEE.
Chicago Style (17th ed.) CitationLi, Guojiong, et al. A Novel Hybrid Photonic Integration Scheme Based on Flip-Chip Bonding Combined With Vertical Coupling. IEEE.
MLA (9th ed.) CitationLi, Guojiong, et al. A Novel Hybrid Photonic Integration Scheme Based on Flip-Chip Bonding Combined With Vertical Coupling. IEEE.
Warning: These citations may not always be 100% accurate.