A Novel Hybrid Photonic Integration Scheme Based on Flip-Chip Bonding Combined With Vertical Coupling

A Novel Hybrid Photonic Integration Scheme Based on Flip-Chip Bonding Combined With Vertical Coupling

A hybrid photonic integration scheme based on flip-chip bonding combined with vertical coupling is presented in this work, offering a novel solution for the integration of active and passive chips. An offset quantum-well laser is flipped and bonded into the pre-set cavity of the passive chip. The li...

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Bibliographic Details
Main Authors: Guojiong Li, Xiangyang Dai, Yuanhao Zhang, Liyuan Song, Panpan Yu, Minwen Xiang, Can Liu, Juan Xia, Qiaoyin Lu, Weihua Guo
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Photonics Journal
Subjects:
Hybrid photonic integration
flip-chip bonding
vertical coupling
large tolerance
optical circuit board
Online Access:https://ieeexplore.ieee.org/document/10964542/
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