Image processing for microprocessors TIM voids detection
Thermal interface material (TIM) is a substance designed to enhance thermal conductivity between two surfaces requiring efficient heat transfer. It is commonly applied between a microprocessor's silicon die and a heat sink or other cooling components, such as heat spreaders, to minimize t...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | deu |
| Published: |
NDT.net
2025-03-01
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| Series: | e-Journal of Nondestructive Testing |
| Online Access: | https://www.ndt.net/search/docs.php3?id=30849 |
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