Advancing Nanoscale Copper Deposition Through Ultrafast-Laser-Activated Surface Chemistry

Advancing Nanoscale Copper Deposition Through Ultrafast-Laser-Activated Surface Chemistry

Direct-writing submicron copper circuits on glass with laser precision—without lithography, vacuum deposition, or etching—represents a transformative step in next-generation microfabrication. We present a high-resolution, maskless method for metallizing glass using ultrashort pulse Bessel beam laser...

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Bibliographic Details
Main Authors: Modestas Sadauskas, Romualdas Trusovas, Evaldas Kvietkauskas, Viktorija Vrubliauskaitė, Ina Stankevičienė, Aldona Jagminienė, Tomas Murauskas, Dainius Balkauskas, Alexandr Belosludtsev, Karolis Ratautas
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Nanomaterials
Subjects:
direct laser writing
submicron copper circuits
Bessel beam
glass metallization
ultrashort-pulse laser
electroless copper plating
Online Access:https://www.mdpi.com/2079-4991/15/11/830
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