A Novel Three‐Phase Interface Premelting Theory for Determining Unfrozen Water Content in Unsaturated Soil by Xusheng Wan, Jishuai Zhu, Wansheng Pei, Weibo Liu, Fengxi Zhou

“…In this study, a theoretical model for unfrozen water content in unsaturated soils by integrating the generalized interface premelting theory with Gibbs free energy minimization. …”
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Macro–Microscale Research on the Single Shear Characteristics of the Root–Loess Interface in <i>Robinia pseudoacacia</i> by Qi Gu, Bo Hong, Qiangbing Huang, Xiaosen Kang, Dengfei Zhang, Xiaopeng Guo, Gang Liu, Tao Xiao

“…Rainfall-induced weakening of the root–loess interface’s shear strength is a key factor in slope instability, yet research on its shear characteristics remains limited. …”
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Gas Transfer Across Air‐Water Interfaces in Inland Waters: From Micro‐Eddies to Super‐Statistics by Gabriel Katul, Andrew Bragg, Ivan Mammarella, Heping Liu, Qi Li, Elie Bou‐Zeid

“…Abstract In inland water covering lakes, reservoirs, and ponds, the gas exchange of slightly soluble gases such as carbon dioxide, dimethyl sulfide, methane, or oxygen across a clean and nearly flat air‐water interface is routinely described using a water‐side mean gas transfer velocity kL‾, where overline indicates time or ensemble averaging. …”
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Behavior at Air/Water Interface and Oxidative Stability of Vegetable Oils Analyzed Through Langmuir Monolayer Technique by Wiktoria Kamińska, Katarzyna Rzyska-Szczupak, Anna Przybylska-Balcerek, Kinga Stuper-Szablewska, Anna Dembska, Grażyna Neunert

“…This study aimed to evaluate the oxidative stability and surface properties of cold-pressed vegetable oils using the Langmuir monolayer technique. Six oils—milk thistle, evening primrose, flaxseed, camelina sativa, black cumin, and pumpkin seed—were analyzed to investigate their molecular organization and behavior at the air/water interface, particularly after undergoing oxidation. …”
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An Energy Level Alignment Study of 2PACz Molecule on Perovskite Device‐Related Interfaces by Vacuum Deposition by Jielei Li, Shengwen Li, Bingchen He, Ruifeng Zheng, Yulin Wang, Shi Chen

“…Self‐assembling molecules (SAM) have been widely used in inverted perovskite solar cells (PSC) as a hole transfer layer due to nearly lossless charge transfer giving excellent device performance. …”
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Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces by Jaderson Rodrigo da Silva Leal, Rodrigo André Valenzuela Reyes, Guilherme Lisboa de Gouveia, Francisco Gil Coury, José Eduardo Spinelli

“…The adhesions of the formed intermetallics films in Cu and Ni were analyzed using tensile tests. It was observed that the alloy/Ni couple exhibited better adhesion. …”
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Information requirement analysis for establishing intelligent natural language query interfaces in BIM-based construction projects by Mengtian Yin, Zhuoqian Wu, Haotian Li, Mun On Wong, Llewellyn Tang, Shu Tang, Junxiang Zhu

“…Emerging artificial intelligence (AI)-based natural language interface (NLI) systems show significant potential for enabling stakeholders to efficiently retrieve complicated building information models (BIM). …”
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Smart interfaces to assist the operator in the context of industry 4.0 with a 5S human-centric approach by Mario Rojas, Javier Maldonado-Romo, Juana Isabel Mendez, Pedro Ponce, Arturo Molina

“…The gloves enable intuitive interaction, enhancing the training efficacy and reducing real-world operational errors. Using the 5S principles—Social, Sustainable, Sensing, Smart, and Safe—this research evaluates the system’s impact across various dimensions. …”
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SEM investigation of interfaces after simultaneous contact of Cu-20Ti and Cu melts with zirconia ceramic by Oleksii Durov, Tatyana Stetsyuk, Oleksandr Umanskyi, Vitaliy Krasovskyy, Olena Poliarus

“…The interfaces for a cooled sample after simultaneous contact of the adhesively active copper-titanium melt and of inert copper melt with ZrO2-ceramic (Cu-20Ti / ZrO2 / Cu system) were investigated using SEM analysis. …”
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Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation test by Young-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeon-Taek Hwang, Seung Hwan Lee, Hak-Sung Kim

“…In this study, the interfacial adhesion strength between copper (Cu) and dielectric films was investigated using laser spallation test. To quantitatively evaluate the interfacial strength, the compressive stress wave generated by laser pulse was precisely calibrated, and interface stress was analyzed through wave propagation simulation. …”
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Enhancing Bone–Cartilage Interface Healing in Osteochondral Autograft Transplantation: Effects of BMAC Augmentation and Rehabilitation Protocols by Robert Gherghel, Ilie Onu, Ana Onu, Ioana-Irina Rezus, Ovidiu Alexa, Daniel Andrei Iordan, Luana Andreea Macovei, Elena Rezus

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Cellular automaton modeling of the local corrosion of ZrO2-C refractories at slag/metal interfaces by Shigefumi Matsumoto, Katsumi Morikawa, Koji Goda, Kiyoshi Goto, Hiroyuki Fukuyama

“…Using actual ZG microstructures, the CA simulation visualized corrosion behavior, revealing new insights. …”
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Study of State of Interface “Intraocular Lens — Posterior Capsule” Depending on Size of Capsulorhexis in Senile Cataract Phacoemulsification by Lina Bai, O. V. Kolenko, A. V. Egorova, A. V. Vasiliev

“…Depending on diameter of performed capsulorhexis, we formed 3 groups: 1st group — 76 eyes with diameter capsulorexis 5.5 mm; 2nd group — 73 eyes with 5.0 mm; 3rd group — 78 eyes with 4.5 mm. We studied type of interface “IOL — PC”, the maximum value of PC diastasis and the maximum depth of its folds using an RTVue-100 Optical Coherence Tomography (Optovue, USA) on the first day after the operation.Results. …”
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Streamlining cVEP Paradigms: Effects of a Minimized Electrode Montage on Brain–Computer Interface Performance by Milán András Fodor, Atilla Cantürk, Gernot Heisenberg, Ivan Volosyak

“…(1) Background: Brain–computer interfaces (BCIs) enable direct communication between the brain and external devices using electroencephalography (EEG) signals, offering potential applications in assistive technology and neurorehabilitation. …”
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Research on power coupling interface in multi-technology fusion collaborative simulation under novel power system by ZOU Shirong, LU Youfei, LIANG Xueqing, LIU Chao, FENG Binjie, XU Jin

“…The traditional V-I interface method and transmission line interface method are analyzed, the interface impedance is parameterized to get a general simulation interface, and it is proved that the traditional V-I method and transmission line method can be regarded as their special cases. …”
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Study on Mechanism of Surfactant Adsorption at Oil–Water Interface and Wettability Alteration on Oil-Wet Rock Surface by Xinyu Tang, Yaoyao Tong, Yuhui Zhang, Pujiang Yang, Chuangye Wang, Jinhe Liu

“…Additionally, FT-IR, SEM, and contact angle measurements were used to elucidate the interfacial adsorption mechanism between BS-12 and aged cores. …”
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All-optical broadband terahertz modulator based on NiO/Si heterojunction and interface photoconductivity analysis by Minjie Zhou, Ao Li, Shuhan Li, Fan Zhang, Zhiqiang Li, Bing Jin

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Assessing oral surgery residents’ competencies and training needs in tomography interfaces through a usability framework by Yaren Dogan, Yigit Sirin

“…Abstract Background Cone Beam Computed Tomography (CBCT) plays a critical role in oral and maxillofacial surgery (OMFS), yet the training needs of residents regarding CBCT viewer interfaces remain underexplored. Effective utilization of these interfaces is essential for accurate diagnosis and treatment planning. …”
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Stress Analysis of the Interface Reaction Layer Between Ni–P Films and GaAs Substrate After Annealing by Koichiro NISHIZAWA, Ayumu MATSUMOTO, Yasuyuki NAKAGAWA, Hitoshi SAKUMA, Yoshiki KOJIMA, Naoki FUKUMURO, Shinji YAE

“…Electroless Ni–P plating films, used as the seed layers for the backside electrodes of gallium arsenide (GaAs) semiconductor devices, cause substrate warping (wafer warpage) during annealing, leading to substrate cracking and chipping. …”
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Room‐Temperature Processable Stretchable Conductive Composite Material for Electrical Interfacing in Stretchable Printed Circuit Boards by Duho Cho, Donggoo Jang, Changju Chae, Sun Hong Kim, Taesu Kim, Su Yeon Lee, Jang‐Ung Park, Youngmin Choi, Sungmook Jung

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