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Laser Scribing Optimization of RF Magnetron Sputtered Molybdenum Thin Films
Published 2011-01-01“…The thickness of Mo was in the range of 60 nm to 800 nm. For the scribing process the laser power and the laser pulse frequency were varied. …”
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102
Performance and variability analysis of ALD-grown wafer scale HfO2/Ta2O5-based memristive devices for neuromorphic computing
Published 2025-06-01“…Here, we report a large-scale wafer microfabrication process and in-depth electrical analysis of atomic layer deposition (ALD) grown bilayer (i.e., HfO2/Ta2O5) memristive devices. …”
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Optimization of Process Parameters and Microstructure of CoCrFeNiTiAl High-Performance High-Entropy Alloy Coating
Published 2024-12-01“…The optimum parameters for the preparation of high-performance high-entropy alloy coatings are found at laser power P = 676.73 W, cladding speed V = 5 mm/s, and pulse width P<sub>0</sub> = 9 ms. The microstructures of the high-entropy alloy coating prepared with optimal process parameters have been characterized, which show that the metallurgical bonding between the cladding layer and the substrate is strong and without obvious defects such as porosity and cracks.…”
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Stack and Structure: Ultrafast Lasers for Additive Manufacturing of Thin Polymer Films for Medical Applications
Published 2025-04-01“…Within this work, first investigations on the joining, cutting, and structuring of thin polymer films with layer thickness of between 50 and 100 µm using a ps-pulsed laser are reported. …”
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107
Enhanced laser-induced single-cycle terahertz generation in a spintronic emitter with a gradient interface
Published 2025-12-01“…The development of spintronic emitters of broadband terahertz (THz) pulses relies on designing heterostructures in which the processes of laser-driven spin current generation and subsequent spin-to-charge current conversion are the most efficient. …”
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108
Studying Heat-Affected Zone, Surface Roughness and Material Removal Rate in NPMEDM Process for Inconel 718 Using Nano Silicon Carbide Powder
Published 2025-03-01“…The chosen process variables were discharge current, pulse on time, powder concentration, and magnetic field. …”
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109
Improvement of Micro-Hole Processing in SiC<sub>f</sub>/SiC Ceramic Matrix Composite Using Efficient Two-Step Laser Drilling
Published 2025-04-01“…The results of the single-parameter variation and optimized orthogonal experiments reveal that the optimal parameters for laser pre-drilling in air to process micro-holes are as follows: 1000 processing cycles, 0.7 mJ single-pulse energy, −4 mm defocus, 15 kHz pulse-repetition frequency, and 85% overlap rate. …”
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Ultrasonic characterization of material heterogeneities in stainless steel components produced by laser powder bed fusion
Published 2025-07-01“…Our results indicate that accurate characterization requires careful selection of ultrasonic propagation paths, which must consider the direction of additive layering, variations in processing parameters, and the component's geometry. …”
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112
Ion Gel-Modulated Low-Temperature Field-Effect Phototransistors with Multispectral Responsivity for Artificial Synapses
Published 2025-04-01“…The ion-gel dielectric in the coplanar-structured transistor, fabricated via ink-jet printing, exhibits excellent double-layer capacitance (>1 μF/cm<sup>2</sup>) and supports low-voltage operation through lateral gate coupling. …”
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113
Advancing Nanoscale Copper Deposition Through Ultrafast-Laser-Activated Surface Chemistry
Published 2025-05-01“…Compared to conventional redistribution-layer (RDL) and under-bump-metallization (UBM) techniques, this process eliminates multiple lithographic and vacuum-based steps, significantly reducing process complexity and production time. …”
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114
Neural network technology for identifying defect sizes in half-plane based on time and positional scanning
Published 2020-10-01“…MATLAB complex was used as a simulation of the application process (ANN). Results. A finite element model of a layered structure has been developed in a flat formulation of the problem in the ANSYS package. …”
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Ti and TiAlV foils enhanced with PLD and flash-deposited carbon: On cytocompatibility and antibacterial activity
Published 2025-06-01“…In this study, we investigated the effects of carbon layer deposition on titanium (Ti) and titanium alloy (TiAlV) substrates using ''flash'' vaporization and pulsed laser deposition (PLD) techniques. …”
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117
Development of new scaffolds for bone substitution by electrospinning and laser ablation
Published 2025-03-01“…Good results were obtained for all coated PVDF fibres, but especially in the case of PLD processing with a thicker layer of silicate glass, the imaging evaluation suggested a superior beneficial impact on cellular metabolism. …”
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118
One-Pot Anodic Electrodeposition of Dual-Cation-Crosslinked Sodium Alginate/Carboxymethyl Chitosan Interpenetrating Hydrogel with Vessel-Mimetic Heterostructures
Published 2025-06-01“…Typically, the anodic electrodeposition is performed in a mixture of sodium alginate (SA) and carboxymethyl chitosan (CMC), with the ethylenediaminetetraacetic acid calcium disodium salt hydrate (EDTA·Na<sub>2</sub>Ca) incorporated to provide a secondary ionic crosslinker (i.e., Ca<sup>2+</sup>) and modulate the cascade reaction diffusion process. The copper wire electrodes serve as templates for electrochemical oxidation and enable a copper ion (i.e., Cu<sup>2+</sup>)-induced tubular hydrogel coating formation, while pulsed electric fields regulate layer-by-layer deposition. …”
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Development of a Composite Technique for Preconditioning of 41Cr4 Steel Used as Gear Material: Examination of Its Microstructural Characteristics and Properties
Published 2016-01-01“…Then a hard Cr coating was brush-plated on the intermediate layer. Finally, the coating layer was modified by high current pulsed electron beam (HCPEB), followed by quenching and subsequent tempering treatment. …”
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120
Electrodeposition of Nanostructured Magnesium Coatings
Published 2014-12-01“…In this work, we report on the electroplating of ultrafine and uniform magnesium (Mg) films on copper (Cu) and carbon nanotube (CNT) paper substrates. By controlling the process parameters and utilizing the pulsed deposition method, the average grain size of Mg was reduced to nanodimensions. …”
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