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THE INFLUENCE OF BRAZING TEMPERATURE ON THE METALLOGRAPHIC MICROSTRUCTURE OF THE BONDED WELD
Published 2013-05-01Get full text
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Investigation on the microstructure evolution and strengthening behavior of rolled bonding Cu strip
Published 2025-03-01Get full text
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Influence of Process Parameters on the Microstructural and Mechanical Characteristics of TLP Bonded IN718
Published 2025-06-01“…study explores the role of process parameters in joining IN718 with the TLP bonding process is explored. Microstructure evolution and mechanical performance of the bond are investigated using scanning electron microscopy, tensile test, and micro-hardness test. …”
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Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface
Published 2021-08-01Subjects: Get full text
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Microstructural Evolution in Nonvacuum Solid-State Diffusion Bonded Joints of AA2219
Published 2023-01-01“…Chemical cleaning is adopted to protect the joining surfaces from reoxidation before the diffusion bonding process. Microstructure evolution at the bonded joints is characterized using optical microscopy, scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). …”
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Vacuum Diffusion Bonding of Dissimilar Metal Alloys AA2219 and Ti-6Al-4V: Influence of Bonding Pressure on Microstructure and Mechanical Properties of the Bonding Joint
Published 2025-06-01“…The influence of the bonding pressure on the microstructure and mechanical properties of the bonding joints is investigated. …”
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Diffusion bonding of RAFM steels: Evolution of interfacial oxide layer with pressure and microstructure and mechanical property after post bonding heat treatment
Published 2024-01-01Subjects: “…bonding pressure…”
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Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor
Published 2024-12-01“…In this study, we employed a multi-objective topology optimization approach to design a porous microstructure for the die-bonding layer of semiconductors, targeting high thermal conductivity and low shear modulus. …”
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Study on Interface Microstructure and Bonding Properties of Hot-Rolled Nickel-Based Composite Plate
Published 2022-01-01“…In this paper, the interface microstructure, elements’ diffusion features at the interface, and bonding properties in nickel-based alloy/carbon steel clad composite prepared by vacuum hot-roll bonding were investigated, comprehensively. …”
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Microstructure and bonding properties of hot-rolled 7075/AZ31B clad sheets
Published 2020-05-01Subjects: Get full text
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Microstructure and Performance of Mechanically Plated Zn-Ti Composite Coating
Published 2021-01-01Subjects: “…mechanical plating; titanium powder; composite coating; microstructure; mechanical bonding…”
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Effect of diffusion temperatures on microstructure and properties of NiCoCrAlYHf bond coatings
Published 2024-12-01Get full text
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Effect of heat treatment on microstructure and properties of hybrid manufacturing TC4 alloy bonding zone
Published 2025-01-01“…The effects of different heat treatments on the microstructure and properties of the bonding zone of the hybrid manufacturing sample were studied. …”
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Microstructural evolution and mechanical properties of chip-stacking micro-solder joints under TG bonding process
Published 2025-09-01“…As chip-stacking micro-joints are downsized to less than 20 μm, the microstructural evolution induced by multiple TG bonding has emerged as a critical concern for mechanical properties. …”
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Mechanical properties and microstructural analysis of laterite stone masonry from India for sustainable construction
Published 2024-12-01“…This study examines the laterite stone masonry performance, with a specific focus considering its mechanical properties, mineral composition, and microstructure. However, mineralogical composition and microstructural features vary, affecting mechanical qualities and endurance. …”
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Effect of bonding temperature on microstructure and mechanical properties of TLP-bonded Ti-6Al-4V/Inconel 718 joints using BNi2/Cu interlayer
Published 2025-12-01“…Microstructural analysis indicated the formation of intermetallic compounds like Ti2Cu, Ti2Ni, NiTi, and Ni3Ti within the diffusion-affected zone (DAZ) and solidification zone (SZ) of the TLP-bonded samples. …”
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