Showing 161 - 180 results of 349 for search 'materials low array', query time: 0.11s Refine Results
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    Experimental Investigation of Heat-Treated Tool on Wire Electric Discharge Machining of Titanium Alloy (Ti-6Al-4V) by R. Manoj Samson, Ashvin Sridhar, R. Ranjith, Solomon Jenoris Muthiya, Joshuva Arockia Dhanraj, Murgayya S. Basavankattimath, Agegnehu Shara Shata

    Published 2022-01-01
    “…Taguchi L9 orthogonal array was used. Ton (Pulse ON time), Toff (Pulse OFF time), wire feed, and Ip (Current) were the input parameters, and the response parameters such as surface roughness (Ra), material removal rate (MRR), tool wear rate (TWR), and recast layer thickness were optimized by TOPSIS optimization. …”
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  6. 166

    A hybrid approach for the machinability analysis of Incoloy 825 using the entropy-MOORA method by Sahu Saurabh Kumar, Shekhar Shiena, Khan Akhtar, Soni Dheeraj Lal, Gangwar Prashant Kumar, Gupta Manish

    Published 2024-11-01
    “…The experiments were conducted using Taguchi’s L27 orthogonal array, following the principles of experimental design. …”
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  7. 167

    Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

    Published 2025-01-01
    “…In contemporary society, the growing reliance on electronic devices has necessitated the phasing out of traditional Sn–Pb solder due to its health hazards, prompting a transition to environmentally friendly, lead-free alternatives.This study aims to address the challenges of poor interfacial reliability and high cost associated with eutectic Sn–Ag–Cu solders by investigating the creep properties and service life of a low-silver solder alloy, Sn-0.3Ag-0.7Cu, as a filler material.The creep behavior of Sn-0.3Ag-0.7Cu was analyzed through creep testing, and fracture modes were identified via microstructural and fracture surface analysis.The Anand viscoplastic model was employed to simulate and calibrate the creep behavior, with its accuracy validated via thermal cycling experiments.Furthermore, the creep behavior of Ball Grid Array (BGA) solder joints was simulated using Abaqus software to examine the impact of creep on joint longevity and the influence of temperature on performance.…”
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  8. 168

    Selective Laser Sintering of Polymers: Process Parameters, Machine Learning Approaches, and Future Directions by Hossam M. Yehia, Atef Hamada, Tamer A. Sebaey, Walaa Abd-Elaziem

    Published 2024-09-01
    “…However, manufacturing plastic components using SLS poses significant challenges due to issues like low strength, dimensional inaccuracies, and rough surface finishes. …”
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  9. 169

    High‐Performance Flexible Silicon Nanowire Field Effect Transistors on Plastic Substrates by Ting Zhang, Ying Sun, Ruijin Hu, Wentao Qian, Linwei Yu

    Published 2025-04-01
    “…In this work, the integration of ordered arrays of silicon nanowire (SiNW) field effect transistors (FETs) directly onto flexible plastic substrates is showcased. …”
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  10. 170

    Inkjet‐Printed Phase Change Memory Devices by Hanglin He, Dhananjeya Kumaar, Kevin Portner, Till Zellweger, Florian M. Schenk, Simon Wintersteller, Vitor Vlnieska, Alexandros Emboras, Vanessa Wood, Maksym Yarema

    Published 2024-11-01
    “…This paper provides a novel approach to liquid‐based engineered PCM devices through inkjet printing, enabling patterned memory layers, lower price‐per‐bit, and customizable multi‐material PCM arrays.…”
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    Nitrogen-vacancy centers in epitaxial laterally overgrown diamond: towards up-scaling of color center-based quantum technologies by Nimba Oshnik, Sebastian Westrich, Nina Burmeister, Oliver Roman Opaluch, Lahcene Mehmel, Riadh Issaoui, Alexandre Tallaire, Ovidiu Brinza, Jocelyn Achard, Elke Neu

    Published 2025-01-01
    “…Native color centers offer a sensitive probe for local crystal quality in such novel materials e.g. via their reaction to stress. In this work, we investigate individual native nitrogen-vacancy (NV) centers in SCD layers manufactured via laterally overgrowing hole arrays in a heteroepitaxially grown large-scale substrate. …”
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    Nano hierarchical hill-like structure with TA1 surface manufactured by LIPSS for anti-corrosion and anti-icing by Guolong Wang, Ji Wang, Kaijie Cheng, Kun Yang, Wenwu Zhang

    Published 2025-03-01
    “…However, in practical engineering applications, the surface of titanium metal is easily affected by complex environments, significantly shortening its service life. Manufacturing TA1 materials with corrosion resistance and low ice adhesion remains a significant challenge. …”
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    Design Considerations for Sub-1-V 1T1C FeRAM Memory Circuits by Mohammad Adnaan, Sou-Chi Chang, Hai Li, Yu-Ching Liao, Ian A. Young, Azad Naeemi

    Published 2024-01-01
    “…We focus on the most promising ferroelectric materials, hafnium zirconium oxide (HZO) and barium titanate (BTO), known for their fast switching speeds and low coercive voltages. …”
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    Massive Screening of Food Extracts for Quality Assessment and Standardization of Allergenic Activity by Luis Antonio Tortajada-Genaro

    Published 2024-12-01
    “…The biosensing method is based on immobilizing low volumes of protein extracts (40 nL) on thermoplastic chips in array format. …”
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    Integrated geophysical investigation for pavement failure along a dual carriage way, Southwestern Nigeria: a case study by Akinola M. Adesola, Akinlalu A. Ayokunle, Adelusi O. Adebowale

    Published 2017-11-01
    “…The results of the study showed that the near surface subsoil on which the road pavement is founded within the failed segments is predominantly characterized by low resistive materials (<100 Ωm) which are typical of incompetent clay formation. …”
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