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  1. 201

    Genotoxicity of Copper and Nickel Nanoparticles in Somatic Cells of Drosophila melanogaster by Erico R. Carmona, Alba García-Rodríguez, Ricard Marcos

    Published 2018-01-01
    “…Copper and nickel nanoparticles (Cu-NPs and Ni-NPs, respectively) are used in a variety of industrial applications, such as semiconductors, catalysts, sensors, and antimicrobial agents. …”
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  2. 202

    Introduction to the Growers IPM Guide for Florida Tomato and Pepper Production by Norman C. Leppla

    Published 2008-01-01
    “…IPM-200/IN732: Introduction to the Growers IPM Guide for Florida Tomato and Pepper Production (ufl.edu) Ask IFAS: IPM Guide for Florida Tomato and Pepper Production (ufl.edu) …”
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    Article
  3. 203

    A Piecewise Hysteresis Model for a Damper of HIS System by Kaidong Tian, Bangji Zhang, Nong Zhang, Xuhui Liu, Jinchen Ji

    Published 2016-01-01
    “…A damper of the hydraulically interconnected suspension (HIS) system, as a quarter HIS, is prototyped and its damping characteristic is tested to characterize the damping property. …”
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  4. 204
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    Modeling and Parameter Identification of the MR Damper Based on LS-SVM by Cheng Qian, Xiaoliang Yin, Qing Ouyang

    Published 2021-01-01
    “…In order to identify the nonlinear characteristics of the magnetorheological (MR) damper applied in multi-DOF vibration reduction platforms in the aerospace field in the modeling process, the least square support vector machine (LS-SVM) method is adopted, because LS-SVM can handle small-sample, high-dimensional characteristic problems. …”
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    Experimental and Theoretical Investigations of a Displacement-Amplified Torsional Damper by Huimin Mao, Xueyuan Yan, Xiangliang Ning, Shen Shi

    Published 2021-01-01
    “…In this work, a displacement-amplified torsional damper (DATD) is proposed for improving the seismic capacity of the beam-column joints of a frame structure. …”
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  9. 209

    A Summary of N, P, and K Research with Pepper in Florida by George Hochmuth, Ed Hanlon

    Published 2011-01-01
    “…SL 334/CV230: A Summary of N, P, and K Research with Pepper in Florida (ufl.edu) …”
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    Effect of Lithium Ions on Copper Nanoparticle Size, Shape, and Distribution by Kyung-Deok Jang, Ada Ortega, Justin Ucol, Hao Du, Nam-Soo Kim

    Published 2012-01-01
    “…In this study, the conventional approach of increasing particle size by the concentration of copper ions and PGPPE in a copper chloride solution was compared to increasing the concentration of lithium chloride when the copper chloride concentration was held constant. …”
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  14. 214

    Photocatalytic Surface Modification of PI Film for Electroless Copper Plating by Wenxia Zhao, Zenglin Wang, Liang Qiao, Shiwei Liu, Hongjian Zhao, Yani Yan

    Published 2018-01-01
    “…The results indicated that, after surface modification under the optimal photocatalytic conditions, the surface contact angle of the PI film decreased from 84.4° to 38.8°, and the adhesion strength between the PI film and the electroless copper film reached 0.78 kN/m. X-ray photoelectron spectroscopy analysis further demonstrated that carboxyl groups formed on the surface of the PI film after photocatalytic treatment. …”
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    Reduction of Structural Vibrations by Passive and Semiactively Controlled Friction Dampers by L. Gaul, J. Becker

    Published 2014-01-01
    “…In the chosen experimental implementation, a piezoelectric stack actuator is used to apply adjustable normal forces between a structure and an attached friction damper. Simulation and experimental results of a benchmark structure with passive and semiactively controlled friction dampers are compared for stationary narrowband excitation. …”
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  18. 218

    Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper by Lung-Chuan Tsao, Cheng-Kai Li, Yu-Kai Sun, Shih-Ying Chang, Tung-Han Chuang

    Published 2021-01-01
    “…Due to the combined advantages of low cost, good soldering properties, and appropriate melting temperature range, novel Sn8Zn3Bi1Mg active solder was developed for direct soldering of transparent conductive oxide (TCO) ceramic targets with oxygen-free copper at 200°C in air. The TCO specimens have aluminum-doped zinc oxide (AZO) and zinc oxide (ZnO) ceramics. …”
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