Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography by Niklas Piechulek, Lei Xu, Jan Fröhlich, Patrick Bründl, Jörg Franke

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Ferroelectric memory: state-of-the-art manufacturing and research by D. A. Abdullaev, R. A. Milovanov, R. L. Volkov, N. I. Borgardt, A. N. Lantsev, K. A. Vorotilov, A. S. Sigov

“…State-of-the-art FRAM manufacturing is studied in this paper. Ferroelectric capacitors and memory cells made by main commercial FRAM manufactures (Texas Instruments, Cypress Semiconductor, Fujitsu и Lapis Semiconductor) are explored. …”
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Design for Additive Manufacturing of Lattice Structures for Functional Integration of Thermal Management and Shock Absorption by Enrico Dalpadulo, Mattia Pollon, Alberto Vergnano, Francesco Leali

“…This study presents a design for additive manufacturing method for integrating multiple lattice structures to achieve thermal management and shock absorption functions. …”
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Monitoring the reliability of integrated circuits protection against Trojans: encoding and decoding of combinational structures by L. A. Zolotorevich, V. A. Ilyinkov

“…Trojans can be introduced into the integrated circuits structure both on the development stage and during the production process, including the stages of specification, design, verification and manufacturing. …”
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Ink-jetting-based conformal additive manufacturing: advantages, opportunities, and challenges by Hao Yi, Xiaoqi Guo, Fangle Chang, Huajun Cao, Jia An, Chee Kai Chua

“…Ink-jetting printing stands out among various conformal additive manufacturing techniques for its multi-material, digital control, and process flexibility. …”
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Temperature Control of Quartz-Glass Melting Areas in Laser Additive Manufacturing by Jing Chen, Zeping Lv, Xuanjia Zhang, Tao Xu, Yuntao Cheng

“…Direct energy deposition is an additive technology that can quickly manufacture irregularly shaped quartz-glass devices. …”
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Obfuscation of combination circuits of digital devices from unauthorized access by L. A. Zolotorevich

“…We consider the formation of a common approach to solving problems of control and verification in the design of modern integrated circuits based on the analysis of fault models of structural realizations of digital devices, errors arising in the design process, as well as deliberate distortions during the design and manufacturing stages, i. e. creation and development of taxonomy of possible deviations in the project. …”
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Auricular bioelectronic devices for health, medicine, and human-computer interfaces by William J. Tyler

“…Together, these advances have enabled the design and engineering of bioelectronic devices with integrated multimodal sensing and stimulation capabilities to be worn nearly anywhere on the body. …”
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A fault tolerant CSA in QCA technology for IoT devices by Saeid Seyedi, Hatam Abdoli

“…Abstract According to recent research, with the ever-increasing use of Internet of Things (IoT) devices, there has arisen an ever-growing need for high-performance yet low-power circuits that can efficiently process information. …”
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COVID-19 and the Medical Devices in India: Trade for a Resilient Health System by Ravinder Jha, Diwas Saun, Indrani Gupta

“…The public health care facilities should procure domestically manufactured medical devices and trade with neighbouring countries to reduce import concentration must be prioritised.…”
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Recent advances in iontophoresis-assisted microneedle devices for transdermal biosensing and drug delivery by Gaobo Wang, Natsuho Moriyama, Soichiro Tottori, Matsuhiko Nishizawa

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Vibration Mitigation in the Transport of Fruit Boxes Using 3D-Printed Devices by Pedro Sanchez-Cachinero, Cristina Aguilar-Porro, Rafael R. Sola-Guirado

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High-strength Au–Au bonding for temperature and pressure integrated sensor by Mimi Huang, Yong Xia, Xiangguang Han, Yi Gao, Shuai Chen, Zeyu Cui, Cheng Zhang, Yushan Gao, Zhixia Qiao, Yang Lv, Xiaowei Hou, Chenying Wang, Ping Yang, Libo Zhao

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Peculiarities of Integrating Mechanical Valves in Microfluidic Channels Using Direct Laser Writing by Lucero Hernandez-Cedillo, Deividas Andriukaitis, Lukas Šerpytis, Tomas Drevinskas, Olga Kornyšova, Vilma Kaškonienė, Mantas Stankevičius, Kristina Bimbiraitė-Survilienė, Audrius Sigitas Maruška, Linas Jonušauskas

“…One of the main areas of development directions in this field is the usage of additive manufacturing to fabricate functional components that would be later integrated directly into the human body. …”
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Dense integration of chlorocatechols crosslinked polyphenylene sulfide solid-state separator for Li metal-free batteries by Haitao Zhou, Lianlu Wan, Jiacheng Han, Jian-Chun Wu, Yihong Deng, Jie Gu, Huanggang Wang, Hongquan Gao, Zilong Su

“…Moreover, the dense integration structure and chlorocatechol groups contribute to a higher Li+ transference number and more effectively inhibit the growth of Li dendrites. …”
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Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators by Madison Manley, James Read, Ankit Kaul, Shimeng Yu, Muhannad Bakir

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Bistable Soft Shells for Programmable Mechanical Logic by Nan Yang, Yuming Lan, Miao Zhao, Xiaofei Shi, Kunpeng Huang, Zhongfa Mao, Damiano Padovani

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A Miniaturized Planar Monopole Antenna Based on a Coupling Structure for Compact Mobile Internet of Things (IoT) and Electric Vehicles (EVs) Device Applications in 5G, LTE, WLAN, W... by Ming-An Chung, Chih-Wei Yang

“…This design is embedded side edge of overall placement in the device and is integrated applicable to the trend of heterogeneous wireless multiple access networks in electric vehicle and Internet of Things system devices, which covered the 5G with supporting the band of n7/n38/n40/n53/n77/n78/n79/n90, the 4G with supporting the band of 7/38/40/41/42/43/48/67, the V2X and DSRC for the operating frequencies between 2500 and 5000 MHz, the Sirius/XM Radio for the operating frequencies of 2320–2345 MHz, the ISM band of WiFi and BT covering the band of 2450–2483.5 and 5150–5350 MHz, and the WiMAX also supporting the band of 2300–2690 and 3400–3690 MHz. …”
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Comparative analysis of a 3D printed polymer bonded magnet composed of a TPU-PA12 matrix and Nd-Fe-B atomised powder and melt spun flakes respectively by Granit Hajra, Mihael Brunčko, Leo Gusel, Ivan Anžel

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Three-dimensional direct lithography of stable quantum dots in hybrid glass by Dezhi Zhu, Shangben Jiang, Ying Wang, Dejun Liu, Weijia Bao, Liwei Liu, Junle Qu, Yiping Wang, Changrui Liao

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