THE INFLUENCE OF BRAZING TEMPERATURE ON THE METALLOGRAPHIC MICROSTRUCTURE OF THE BONDED WELD by Andrei DIMITRESCU

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Investigation on the microstructure evolution and strengthening behavior of rolled bonding Cu strip by Jun Cao, Junchao Zhang, Huiyi Tang, Xiaoyu Shen, Kexing Song, Yanjun Zhou, Chengqiang Cui

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Influence of Process Parameters on the Microstructural and Mechanical Characteristics of TLP Bonded IN718 by U.K. Tarai, S. Dwibedi, D.R. Biswal, A.R. Biswal, Madhab Behera, Suyog Jhavar

“…study explores the role of process parameters in joining IN718 with the TLP bonding process is explored. Microstructure evolution and mechanical performance of the bond are investigated using scanning electron microscopy, tensile test, and micro-hardness test. …”
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Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface by YANG Jie, LIU Guang-xu, ZHANG Jing, WANG Wen-ying, WANG Xiao-feng, ZOU Jin-wen

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Microstructural Evolution in Nonvacuum Solid-State Diffusion Bonded Joints of AA2219 by Manjunath Vatnalmath, V. Auradi, V. Bharath, Madeva Nagaral, N. Nagaraj, A. Haiter Lenin

“…Chemical cleaning is adopted to protect the joining surfaces from reoxidation before the diffusion bonding process. Microstructure evolution at the bonded joints is characterized using optical microscopy, scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). …”
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Tailored microstructure and enhanced bonding strength of in-situ surface modified Cu flakes via oxidation–reduction bonding by Siliang He, Xiangdong Liu, Zhiliang Pan, Sheng Gao, Yang Zuo, Hiroshi Nishikawa

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Microstructure and Performance of Mechanically Plated Zn-Ti Composite Coating by ZHANG Jun, WANG Sheng-min, ZHAO Xiao-jun

Subjects: “…mechanical plating; titanium powder; composite coating; microstructure; mechanical bonding…”
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Experimental analysis of the chloride diffusion and bonding properties, microstructural performance of concrete in the rainy environment by Hesong Jin, Lei Cheng, Jun Liu, Hao Zhou

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Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor by Jiaxin Zhou, Ikumu Watanabe, Weikang Song, Keita Kambayashi, Ta-Te Chen

“…In this study, we employed a multi-objective topology optimization approach to design a porous microstructure for the die-bonding layer of semiconductors, targeting high thermal conductivity and low shear modulus. …”
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Study on Interface Microstructure and Bonding Properties of Hot-Rolled Nickel-Based Composite Plate by Yunzan Ma, Weijiang Yang, Qi Liu, Kejia Liu, Kun Chen

“…In this paper, the interface microstructure, elements’ diffusion features at the interface, and bonding properties in nickel-based alloy/carbon steel clad composite prepared by vacuum hot-roll bonding were investigated, comprehensively. …”
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Microstructure and bonding properties of hot-rolled 7075/AZ31B clad sheets by Zong-he WU, Zi-chen QI, Peng-peng XU, Yun-peng ZHAO, Hong XIAO

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Experimental evaluation of Mode II fracture and microstructure of matrix-aggregate bond of concrete with crushed limestone by Grzegorz Ludwik Golewski, Xinyue Xi, Yuanxun Zheng, Jingbo Zhuo, Peng Zhang, Rafał Panek

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Hydrogen Bond Integration in Potato Microstructure: Effects of Water Removal, Thermal Treatment, and Cooking Techniques by Iman Dankar, Amira Haddarah, Montserrat Pujolà, Francesc Sepulcre

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Effect of diffusion temperatures on microstructure and properties of NiCoCrAlYHf bond coatings by ZHANG Bin, DING Ning, CAI Yan, ZHAO Wenjun, LIU Yuzhuo, MU Rende, ZHANG Xuejun

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Effect of heat treatment on microstructure and properties of hybrid manufacturing TC4 alloy bonding zone by Jun Zhang, Peizhi Yang, Haiou Yang, Wenzhe Yang, Kuitong Yang, Wenya Xu

“…The effects of different heat treatments on the microstructure and properties of the bonding zone of the hybrid manufacturing sample were studied. …”
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Diffusion bonding of RAFM steels: Evolution of interfacial oxide layer with pressure and microstructure and mechanical property after post bonding heat treatment by Chen J.-G., Wang W.-J., Dong J., Wang C.-C., Wei Y.-S.

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Mechanical properties and microstructural analysis of laterite stone masonry from India for sustainable construction by Dhanalakshmi Kiran Bhat, Kiran Kamath, Susanta Banerjee, Kiran Bhat P, Haytham F. Isleem

“…This study examines the laterite stone masonry performance, with a specific focus considering its mechanical properties, mineral composition, and microstructure. However, mineralogical composition and microstructural features vary, affecting mechanical qualities and endurance. …”
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Vacuum Diffusion Bonding of Dissimilar Metal Alloys AA2219 and Ti-6Al-4V: Influence of Bonding Pressure on Microstructure and Mechanical Properties of the Bonding Joint by Manjunath Vatnalmath, Virupaxi Auradi, Bharath Vedashantha Murthy, Madeva Nagaral, Veeresh Kumar G B, Suresh Shetty, SURESH SHETTY

“…The influence of the bonding pressure on the microstructure and mechanical properties of the bonding joints is investigated. …”
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Microstructural evolution and mechanical properties of chip-stacking micro-solder joints under TG bonding process by Ye Tian, Hongsheng Xu, Yuejun Li, Zhongyu Liu, Daoming Fan, Chao Wang, Ziqiang Li, Wei Liu, Xing Chen, Fengshun Wu

“…As chip-stacking micro-joints are downsized to less than 20 μm, the microstructural evolution induced by multiple TG bonding has emerged as a critical concern for mechanical properties. …”
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Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive by Shin-Il Go, Yinsheng Li, Jae-Woong Ko, Ha-Neul Kim, Se-Hun Kwon, Hai-Doo Kim, Young-Jo Park

“…The particle size effect of MgO as a sintering additive on the thermal conductivity of sintered reaction-bonded silicon nitride (SRBSN) was investigated. It was revealed that the size of MgO is critical for thermal conductivity with regard to the microstructural evolution process. …”
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