АНАЛИЗ КАЧЕСТВА МУЧНЫХ КОНДИТЕРСКИХ ИЗДЕЛИЙ С ИСПОЛЬЗОВАНИЕМ МЕТОДА РАЗВЕРТЫВАНИЯ ФУНКЦИИ КАЧЕСТВА... by Ирина Юрьевна Резниченко, Дарья Дмитриевна Агеенко, Михаил Сергеевич Щеглов

Subjects: “…quality deployment function, consumer preferences matrix, wafers with fillings, consumer expectations, technical characteristics…”
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Solid‐Solution Limits and Thorough Characterization of Bulk β‐(AlxGa1‐x)2O Single Crystals Grown by the Czochralski Method by Zbigniew Galazka, Andreas Fiedler, Andreas Popp, Palvan Seyidov, Saud Bin Anooz, Roberts Blukis, Jana Rehm, Kornelius Tetzner, Mike Pietsch, Andrea Dittmar, Steffen Ganschow, Arub Akhtar, Thilo Remmele, Martin Albrecht, Tobias Schulz, Ta‐Shun Chou, Albert Kwasniewski, Manuela Suendermann, Thomas Schroeder, Matthias Bickermann

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DESIGN PRINCIPLES AND BLOCK SCHEMES OF THE PROBE AUTOMATIC INSPECTION SYSTEMS FOR MICROAND NANOELECTRONICS ON A WAFER by V. A. Minchenko, G. F. Kovalchuk, S. B. Shkolyk

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Collinear Terahertz Generation from LiNbO₃ Wafer Driven by an Ultrafast Yb-Laser by Kang Wang, Hongyang Li, Zhuorui Zheng, Yi Liu, Ye Tian, Liwei Song

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An Improved YOLOv7-Tiny-Based Algorithm for Wafer Surface Defect Detection by Mengyun Li, Xueying Wang, Hongtao Zhang, Xiaofeng Hu

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A Novel Approach to Test-Induced Defect Detection in Semiconductor Wafers, Using Graph-Based Semi-Supervised Learning (GSSL) by Pedram Aridas, Narendra Kumar, Anis Salwa Mohd Khairuddin, Daniel Ting, Vivek Regeev

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Wafer Defect Classification Algorithm With Label Embedding Using Contrastive Learning by Jeongjoon Hwang, Somi Ha, Dohyun Kim

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High‐Efficiency Flexible GaAs/InGaAs Dual‐Junction Solar Cells Fabricated by Metallic Nanoparticle‐Based Wafer Bonding by Yeongho Kim, Suho Park, Thuy Thi Nguyen, Jiyeon Jeon, Byong Sun Chun, Sang Jun Lee

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The Effect of Metal Shielding Layer on Electrostatic Attraction Issue in Glass–Silicon Anodic Bonding by Wenqi Yang, Yong Ruan, Zhiqiang Song

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Structure of Silicon Wafers Planar Surface before and after Rapid Thermal Treatment by U. A. Pilipenko, A. A. Sergeichik, D. V. Shestovski, V. A. Solodukha

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STUDY OF SILICON-INSULATOR STRUCTURE DEFECTS BASED ON ANALYSIS OF A SPATIAL DISTRIBUTION OF A SEMICONDUCTOR WAFERS’ SURFACE POTENTIAL by R. I. Vorobey, O. K. Gusev, A. L. Zharin, A. N. Petlitsky, V. A. Pilipenko, A. S. Turtsevitch, A. K. Tyavlovsky, K. L. Tyavlovsky

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Universal Digital Probe Electrometer for Testing Semiconductor Wafers by A. L. Zharin, U. A. Mikitsevich, A. I. Svistun, K. U. Pantsialeyeu

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Wafer-Scale Monolithic Integration of LEDs with p-GaN-Depletion MOSFETs on a GaN LED Epitaxial Layer by Boseong Son, Huijin Kim, Young-Woong Lee, Purusottam Reddy Bommireddy, Si-Hyun Park

Subjects: “…Wafer-scale monolithic integration…”
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YOLOSeg with applications to wafer die particle defect segmentation by Yen-Ting Li, Yu-Cheng Chan, Chen-Che Huang, Yu-Chang Hsu, Ssu-Han Chen

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Wafer-Level Characterization and Monitoring Platform for Single-Photon Avalanche Diodes by Samuel Parent, Frederic Vachon, Valerie Gauthier, Steve Lamoureux, Alexandre Paquette, Jacob Deschamps, Tommy Rossignol, Nicolas Roy, Philippe Arsenault, Henri Dautet, Serge A. Charlebois, Jean-Francois Pratte

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MODERN RESOURCE-SAVING TECHNOLOGIES IN FOUNDRY PRODUCTION OF JSC «MINSK TRAKTOR PLANT» by F. A. Domotenko, S. I. Sirotenko, A. N. Karas, A. P. Melnikov, S. I. Sirotenko, G. I. Pasyuk

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