Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates by Soares D., Vilarinho C., Barbosa J., Samuel F., Trigo L., Bré P.

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Size-dependent thermodynamic description of the binary Pb-Sn system by Gierlotka W.

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A new thermodynamic description of the binary Sb-Zn system by Gierlotka W.

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Thermodynamic analysis and characterization of alloys in Bi-Cu-Sb system by Živković D., Minić D., Manasijević D., Kostov A., Talijan N., Balanović Lj., Mitovski A., Živković Ž.

Subjects: “…kead-free solder materials…”
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Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders by Ohnuma I., Kainuma R., Ishida K.

Subjects: “…high-tepmerature Pb-free solder…”
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Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

Subjects: “…Lead-free solder…”
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Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance by Tomas Melus, Roman Kolenak, Jaromir Drapala, Mikulas Sloboda, Peter Gogola, Matej Pasak

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Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue by Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang

Subjects: “…Sn-Ag-Cu solder…”
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ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY by V. S. Niss, A. S. Vaskou, A. S. Turtsevich, A. F. Kerentsev, V. K. Kononenko

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Design of Ag-Ge-Zn braze/solder alloys: Experimental thermodynamics and surface properties by Delsante S., Li D., Novakovic R., Borzone G.

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Surdat: Database of physical properties of lead-free solders by Moser Z., Gasior W., Debski A., Pstrus J.

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Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys by Kopyto M., Garzel G., Zabdyr L.A.

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Interfacial reactions between solid Ni and liquid Sn-Zn alloys by Gandova V.

Subjects: “…solders…”
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Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys by Garzel G., Kopyto M., Zabdyr L.A.

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COST531 project: Study of the advanced materials for lead free soldering by Kroupa A., Dinsdale A.T., Watson A., Vrestal J., Zemanova A.

Subjects: “…lead-free solders…”
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Investigation of dissolution resistance of blank and gas-nitrided carbon steels in stationary SAC305 solder alloy melt by Benke M., Salyi Zs., Kaptay G.

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Ni-Bi-Zn ternary system investigation using diffusion couples technique by Gandova V.D.

Subjects: “…solders…”
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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

Subjects: “…lead-free solders…”
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Phase relations near ternary eutectic point in the Ag-In-Sb system by Jendrzejczyk-Handzlik D., Živković Dragana, Gierlotka W., Manasijević D., Fitzner K., Minić D.

Subjects: “…lead-free solders…”
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