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661
A Comparative Analysis of Laser-Ablated Surface Characteristics Between the Si Face and C Face of Silicon Carbide Substrates
Published 2025-01-01“…Silicon carbide (SiC) has significant potential as a third-generation semiconductor material due to its exceptional thermal and electronic properties, yet its high hardness and brittleness make processing costly and complex. …”
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662
The Effect of Channel Layer Thickness on the Performance of GaN HEMTs for RF Applications
Published 2024-12-01Get full text
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663
Photocatalytic Degradation of E.Coli Bacteria by Graphitic Carbon Nitride Photocatalysts under Visible Light Irradiation
Published 2024-08-01“…Graphitic carbon nitride, as a polymeric semiconductor, has attracted significant attention in this field. …”
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664
Plasmonically-enhanced reconfigurable photodetector based on graphene/Sb2S3 heterojunction
Published 2025-01-01Get full text
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665
Insulator–metal transition in VO2 film on sapphire studied by broadband dielectric spectroscopy
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666
An impermeable copper surface monolayer with high-temperature oxidation resistance
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667
A 5.5–7.5‐GHz band‐configurable wake‐up receiver fully integrated in 45‐nm RF‐SOI CMOS
Published 2022-10-01“…Abstract This work investigates a 5.5–7.5‐GHz band‐configurable duty‐cycled wake‐up receiver (WuRX) fully implemented in a 45‐nm radio‐frequency (RF) silicon‐on‐insulator (SOI) complementary‐metal‐oxide‐semiconductor (CMOS) technology. Based on an uncertain intermediate frequency (IF) super‐heterodyne receiver (RX) topology, the WuRX analogue front‐end (AFE) incorporates a 5.5–7.5‐GHz band‐tunable low‐power low‐noise amplifier, a low‐power Gilbert mixer, a digitally controlled oscillator (DCO), a 100‐MHz IF band‐pass filter (BPF), an envelope detector, a comparator, a pulse generator and a current reference. …”
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668
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669
Alteration of Mastication Force via Intraoral Closed-Loop Electrical Stimulation
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670
Short-Circuit Performance Analysis of Commercial 1.7 kV SiC MOSFETs Under Varying Electrical Stress
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671
Low Thermal Resistance of Diamond‐AlGaN Interfaces Achieved Using Carbide Interlayers
Published 2025-02-01“…This study provides a foundation for future research in improving thermal properties of semiconductor devices through interface engineering and advanced measurement methodologies.…”
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672
Polyoxovanadate-modified SnO2 electron transport layer for perovskite photodetectors
Published 2025-03-01“…Polyoxovanadates (POVs), as semiconductor-like molecules, exhibit good redox and excellent optical properties, which can regulate the energy band structure of SnO2. …”
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673
Target Detection Using Fused Unidentical Photonics-Based LFM Sub-Band Radar Signals With an Adaptive Feed Forward Network Equalizer
Published 2025-01-01“…We demonstrate this using optical injection in a semiconductor laser to generate Ph-LFM signals at different IEEE X-KA radar sub-bands: 19.25–23.94 GHz and 24.06–28.31 GHz (bandgap 0.12 GHz), 19.69–23.06 GHz and 23.625–27 GHz (bandgap 0.56 GHz), and 8–11.5 GHz and 12.75–17 GHz (bandgap 1.25 GHz). …”
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674
Dye-based fluorescent organic nanoparticles made from polar and polarizable chromophores for bioimaging purposes: a bottom-up approach
Published 2024-04-01“…Among them luminescent metal-, semiconductor- or oxide-based “hard” nanoparticles have been the most widely used. …”
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675
Heterogeneous integration of amorphous silicon carbide on thin film lithium niobate
Published 2025-01-01“…Despite numerous demonstrations of high-performance LN photonics, processing lithium niobate remains challenging and suffers from incompatibilities with standard complementary metal–oxide–semiconductor (CMOS) fabrication lines, limiting its scalability. …”
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676
Effect of Buffer Charge Redistribution on RF Losses and Harmonic Distortion in GaN-on-Si Substrates
Published 2024-01-01“…With the help of a simplified TCAD model of the GaN-on-Si stack, we link this behavior to slow charge redistribution in the C-doped buffer continuously modifying the flat-band voltage (<inline-formula> <tex-math notation="LaTeX">$\text{V}_{\text {FB}}$ </tex-math></inline-formula>) of the Metal-Insulator-Semiconductor (MIS) structure. Free carrier transport across the buffer is shown to have the greatest contribution on the large time constants, highlighting the importance of vertical transport paths in GaN-on-Si stacks.…”
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677
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g-C<sub>3</sub>N<sub>4</sub> Modified with Metal Sulfides for Visible-Light-Driven Photocatalytic Degradation of Organic Pollutants
Published 2025-01-01“…Graphitic carbon nitride (g-C<sub>3</sub>N<sub>4</sub>) proved to be a promising semiconductor for the photocatalytic degradation of various organic pollutants. …”
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680
EV Hybrid Battery With Integrated Multilevel Neutral-Point-Clamped Interfacing and Lossless Intermodule State-of-Charge Balancing
Published 2025-01-01“…Overall, the proposed approach enables a modular and scalable design of the energy storage system for a wide range of electric vehicles, from only two different standard battery modules and a standard power semiconductor device, while optimizing the battery size for any given battery power and energy specification. …”
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