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Design of Analog Signal Processing Applications Using Carbon Nanotube Field Effect Transistor-Based Low-Power Folded Cascode Operational Amplifier
Published 2018-01-01“…Carbon nanotube (CNT) is one of the embryonic technologies within recent inventions towards miniaturization of semiconductor devices and is gaining much attention due to very high throughput and very extensive series of applications in various analog/mixed signal applications of today’s high-speed era. …”
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42
Optimized Control for MMCs with Reduced Power Loss and Extended Lifetime
Published 2024-01-01“…Compared with the conventional power loss optimization control, the proposed control could decrease the maximal power consumption of the semiconductor devices without increasing the total loss of the SM. …”
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43
A Process Optimization Method of the Mini-LOCOS Field Plate Profile for Improving Electrical Characteristics of LDMOS Device
Published 2023-01-01“…Finally, the optimized laterally diffused metal oxide semiconductor devices have been fabricated, and both figure of merit curves and safe operation area curves are measured. …”
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44
Memristor-based feature learning for pattern classification
Published 2025-01-01“…However, since biological organs may operate differently from semiconductor devices, deep models usually require dedicated hardware and are computation-complex. …”
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45
A soft switching non‐isolated bidirectional DC–DC converter with improved voltage conversion ratio and minimum number of switches
Published 2024-10-01“…Fully soft switching conditions for all semiconductor devices, removing the reverse recovery problem, and a low number of components have led to mitigating switching losses and improving efficiency. …”
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46
Grain engineering for efficient near-infrared perovskite light-emitting diodes
Published 2024-12-01“…However, they still fall short of costly III-V semiconductor devices, which achieve external quantum efficiencies above 30% with high brightness. …”
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47
Semiconductor Membrane Exfoliation: Technology and Application
Published 2025-01-01“…Finally, it offers insights into the potential of high‐end semiconductor manufacturing and flexible semiconductor devices to play a critical role in advancing next‐generation optoelectronics technologies.…”
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Technology and Modeling of Nonclassical Transistor Devices
Published 2019-01-01“…As technology goes into the nanometer regime, semiconductor devices are confronting numerous short-channel effects. …”
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49
Atomistic behavior of Cu–Cu solid-state bonding in polycrystalline Cu with high-density boundaries
Published 2025-02-01“…Low-temperature Cu–Cu solid-state bonding is key for interconnect miniaturization and higher current densities in advanced semiconductor devices. Achieving reliable joints requires effective void closure at the interface, driven by diffusion. …”
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50
Device Modeling Based on Cost-Sensitive Densely Connected Deep Neural Networks
Published 2024-01-01“…Engineers used TCAD tools for semiconductor devices modeling. However, it is computationally expensive and time-consuming for advanced devices with smaller dimensions. …”
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51
In Situ Growth of (−201) Fiber‐Textured β‐Ga2O3 Semiconductor Tape for Flexible Thin‐Film Transistor
Published 2025-01-01“…Furthermore, it is believed that this technique can be extended to other flexible semiconductor devices that require high‐temperature processing.…”
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52
Stability Improvement of an Efficient Graphene Nanoribbon Field-Effect Transistor-Based SRAM Design
Published 2020-01-01“…The development of the nanoelectronics semiconductor devices leads to the shrinking of transistors channel into nanometer dimension. …”
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Low Thermal Resistance of Diamond‐AlGaN Interfaces Achieved Using Carbide Interlayers
Published 2025-02-01“…This study provides a foundation for future research in improving thermal properties of semiconductor devices through interface engineering and advanced measurement methodologies.…”
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Controlled lattice deformation for high-mobility two-dimensional MoTe2 growth
Published 2025-03-01“…Two-dimensional (2D) MoTe2 shows great potential for future semiconductor devices, but the lab-to-fab transition is still in its preliminary stage due to the constraints in the crystal growth level. …”
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