Showing 21 - 40 results of 55 for search '"semiconductor device"', query time: 0.05s Refine Results
  1. 21

    EV Hybrid Battery With Integrated Multilevel Neutral-Point-Clamped Interfacing and Lossless Intermodule State-of-Charge Balancing by Gabriel Garcia-Rojas, Sergio Busquets-Monge, Alber Filba-Martinez, Turev Sarikurt, Salvador Alepuz, Josep Bordonau

    Published 2025-01-01
    “…Overall, the proposed approach enables a modular and scalable design of the energy storage system for a wide range of electric vehicles, from only two different standard battery modules and a standard power semiconductor device, while optimizing the battery size for any given battery power and energy specification. …”
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  8. 28

    Surface Recombination Via Interface Defects in Field Effect Transistors by E. Bendada, K. Raïs, P. Mialhe, J. P. Charles

    Published 1998-01-01
    “…Recombination current at the oxide-semiconductor interface of metal-oxide-semiconductor devices has been analyzed and compared with the experimental result. …”
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    Article
  9. 29

    Characteristics of electrical properties of nanocrystalline systems of zinc and cadmium selenides by V. V. Danshina

    Published 2022-11-01
    “…It is shown that the calculated values correlate with the experimental ones, which will make it possible to predict the stability of the operation of semiconductor devices.…”
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  10. 30

    ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY by V. S. Niss, A. S. Vaskou, A. S. Turtsevich, A. F. Kerentsev, V. K. Kononenko

    Published 2015-12-01
    “…This leads to the need for a detailed thermal analysis of semiconductor devices. The goal of the work is evaluation of thermal parameters of high-power bipolar transistors in plastic packages TO-252 and TO-126 by a method of thermal relaxation differential spectrometry. …”
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    Article
  11. 31

    Surface Electric Potential Measurement with a Static Probe by R. I. Vorobey, O. K. Gusev, A. I. Zharin, V. A. Mikitsevich, K. U. Pantsialeyeu, A. V. Samarina, A. I. Svistun, A. K. Tyavlovsky, K. L. Tyavlovsky

    Published 2023-08-01
    “…Surface electric potential measurements are widely used in non-destructive inspection and testing of precision surfaces, for example, in the production of semiconductor devices and integrated circuits. Features of the construction and application of devices for measuring the surface electric potential using an immovable reference electrode are considered. …”
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  12. 32

    Features of the receiving of piezoelectric thin films by plasma spraying of powdery AlN by V. S. Feshchenko, K. N. Zyablyuk, E. A. Senokosov, V. I. Chukita, D. A. Kiselev

    Published 2020-03-01
    “…A wide range of semiconductor devices are produced from it, such as photodetectors, LEDs, piezoelectric converters, etc. …”
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    Article
  13. 33

    Design and Analysis of a New High Step-Up Converter Using Switched-Inductor-Capacitor Voltage Multiplier Cells for Photovoltaic Application by Ramachandran Rajesh, Natarajan Prabaharan, Eklas Hossain

    Published 2024-01-01
    “…Also, the mathematical expressions for the design of inductors, capacitors, voltage and current stress of semiconductor devices are provided. The proposed converter is simulated in MATLAB-Simulink and validated the effectiveness of the performance using a laboratory-based Prototype of 250 W at 50 kHz with a 60% duty cycle. …”
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    Article
  14. 34

    Global Existence and Large Time Behavior of Solutions to the Bipolar Nonisentropic Euler-Poisson Equations by Min Chen, Yiyou Wang, Yeping Li

    Published 2014-01-01
    “…We study the one-dimensional bipolar nonisentropic Euler-Poisson equations which can model various physical phenomena, such as the propagation of electron and hole in submicron semiconductor devices, the propagation of positive ion and negative ion in plasmas, and the biological transport of ions for channel proteins. …”
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  15. 35

    Improving radiation tolerance with room temperature annealing of pre-existing defects by Md Hafijur Rahman, Felix Cooper, Miguel L. Crespillo, Khalid Hattar, Aman Haque, Fan Ren, Stephen Pearton, Douglas Wolfe

    Published 2025-01-01
    “…Pre-existing defects in semiconductor devices can act as nucleation sites for radiation damage. …”
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    Article
  16. 36

    Optical and Morphological Studies of Thermally Evaporated PTCDI-C8 Thin Films for Organic Solar Cell Applications by Ronak Rahimi, V. Narang, D. Korakakis

    Published 2013-01-01
    “…PTCDI-C8 due to its relatively high photosensitivity and high electron mobility has attracted much attention in organic semiconductor devices. In this work, thin films of PTCDI-C8 with different thicknesses were deposited on silicon substrates with native silicon dioxide using a vacuum thermal evaporator. …”
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  17. 37

    A Novel Approach to Test-Induced Defect Detection in Semiconductor Wafers, Using Graph-Based Semi-Supervised Learning (GSSL) by Pedram Aridas, Narendra Kumar, Anis Salwa Mohd Khairuddin, Daniel Ting, Vivek Regeev

    Published 2025-01-01
    “…The semiconductor industry plays a vital role in modern technology, with semiconductor devices embedded in almost all electronic products. …”
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  18. 38

    Enhanced high-energy proton radiation hardness of ZnO thin-film transistors with a passivation layer by Yongsu Lee, Hae-Won Lee, Su Jin Kim, Jeong Min Park, Byoung Hun Lee, Chang Goo Kang

    Published 2025-01-01
    “…These results highlight the potential of passivated metal-oxide thin films for developing reliable radiation-hardened semiconductor devices that can be used in harsh space environments. …”
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  19. 39

    A fault‐diagnosis and tolerant control technique for five‐level cascaded H‐bridge inverters by Pavan Mehta, Subhanarayan Sahoo, Mayank Kumar

    Published 2021-07-01
    “…The consequences of faults increase as the number of power semiconductor devices increases and may lead to serious damage to the overall system. …”
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  20. 40

    The application of organic materials used in IC advanced packaging:A review by Liu Jikang

    Published 2025-04-01
    “…To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced packaging technologies have been developed, which including flip chip (FC), bumping, fan-in wafer level packaging (FIWLP), fan-out wafer level packaging (FOWLP), 2.5D packaging (interposer), CMOS image sensor through silicon via (CIS-TSV), fan-out panel level packaging (FOPLP) and so on. …”
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