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EV Hybrid Battery With Integrated Multilevel Neutral-Point-Clamped Interfacing and Lossless Intermodule State-of-Charge Balancing
Published 2025-01-01“…Overall, the proposed approach enables a modular and scalable design of the energy storage system for a wide range of electric vehicles, from only two different standard battery modules and a standard power semiconductor device, while optimizing the battery size for any given battery power and energy specification. …”
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Electromagnetic Functions Modulation of Recycled By-Products by Heterodimensional Structure
Published 2025-02-01Get full text
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Ultra‐Broad Emission Copper Halide Scintillator‐Based X‐Ray Imager
Published 2025-01-01Get full text
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Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
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SiC MOSFET with Integrated SBD Device Performance Prediction Method Based on Neural Network
Published 2024-12-01Get full text
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Surface Recombination Via Interface Defects in Field Effect Transistors
Published 1998-01-01“…Recombination current at the oxide-semiconductor interface of metal-oxide-semiconductor devices has been analyzed and compared with the experimental result. …”
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Characteristics of electrical properties of nanocrystalline systems of zinc and cadmium selenides
Published 2022-11-01“…It is shown that the calculated values correlate with the experimental ones, which will make it possible to predict the stability of the operation of semiconductor devices.…”
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ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY
Published 2015-12-01“…This leads to the need for a detailed thermal analysis of semiconductor devices. The goal of the work is evaluation of thermal parameters of high-power bipolar transistors in plastic packages TO-252 and TO-126 by a method of thermal relaxation differential spectrometry. …”
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Surface Electric Potential Measurement with a Static Probe
Published 2023-08-01“…Surface electric potential measurements are widely used in non-destructive inspection and testing of precision surfaces, for example, in the production of semiconductor devices and integrated circuits. Features of the construction and application of devices for measuring the surface electric potential using an immovable reference electrode are considered. …”
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Features of the receiving of piezoelectric thin films by plasma spraying of powdery AlN
Published 2020-03-01“…A wide range of semiconductor devices are produced from it, such as photodetectors, LEDs, piezoelectric converters, etc. …”
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Design and Analysis of a New High Step-Up Converter Using Switched-Inductor-Capacitor Voltage Multiplier Cells for Photovoltaic Application
Published 2024-01-01“…Also, the mathematical expressions for the design of inductors, capacitors, voltage and current stress of semiconductor devices are provided. The proposed converter is simulated in MATLAB-Simulink and validated the effectiveness of the performance using a laboratory-based Prototype of 250 W at 50 kHz with a 60% duty cycle. …”
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Global Existence and Large Time Behavior of Solutions to the Bipolar Nonisentropic Euler-Poisson Equations
Published 2014-01-01“…We study the one-dimensional bipolar nonisentropic Euler-Poisson equations which can model various physical phenomena, such as the propagation of electron and hole in submicron semiconductor devices, the propagation of positive ion and negative ion in plasmas, and the biological transport of ions for channel proteins. …”
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Improving radiation tolerance with room temperature annealing of pre-existing defects
Published 2025-01-01“…Pre-existing defects in semiconductor devices can act as nucleation sites for radiation damage. …”
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Optical and Morphological Studies of Thermally Evaporated PTCDI-C8 Thin Films for Organic Solar Cell Applications
Published 2013-01-01“…PTCDI-C8 due to its relatively high photosensitivity and high electron mobility has attracted much attention in organic semiconductor devices. In this work, thin films of PTCDI-C8 with different thicknesses were deposited on silicon substrates with native silicon dioxide using a vacuum thermal evaporator. …”
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A Novel Approach to Test-Induced Defect Detection in Semiconductor Wafers, Using Graph-Based Semi-Supervised Learning (GSSL)
Published 2025-01-01“…The semiconductor industry plays a vital role in modern technology, with semiconductor devices embedded in almost all electronic products. …”
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Enhanced high-energy proton radiation hardness of ZnO thin-film transistors with a passivation layer
Published 2025-01-01“…These results highlight the potential of passivated metal-oxide thin films for developing reliable radiation-hardened semiconductor devices that can be used in harsh space environments. …”
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A fault‐diagnosis and tolerant control technique for five‐level cascaded H‐bridge inverters
Published 2021-07-01“…The consequences of faults increase as the number of power semiconductor devices increases and may lead to serious damage to the overall system. …”
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The application of organic materials used in IC advanced packaging:A review
Published 2025-04-01“…To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced packaging technologies have been developed, which including flip chip (FC), bumping, fan-in wafer level packaging (FIWLP), fan-out wafer level packaging (FOWLP), 2.5D packaging (interposer), CMOS image sensor through silicon via (CIS-TSV), fan-out panel level packaging (FOPLP) and so on. …”
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