Size-dependent thermodynamic description of the binary Pb-Sn system by Gierlotka W.

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A new thermodynamic description of the binary Sb-Zn system by Gierlotka W.

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Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

Subjects: “…Lead-free solder…”
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Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys by Kopyto M., Garzel G., Zabdyr L.A.

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Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys by Garzel G., Kopyto M., Zabdyr L.A.

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COST531 project: Study of the advanced materials for lead free soldering by Kroupa A., Dinsdale A.T., Watson A., Vrestal J., Zemanova A.

Subjects: “…lead-free solders…”
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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

Subjects: “…lead-free solders…”
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Phase relations near ternary eutectic point in the Ag-In-Sb system by Jendrzejczyk-Handzlik D., Živković Dragana, Gierlotka W., Manasijević D., Fitzner K., Minić D.

Subjects: “…lead-free solders…”
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Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys by Sklyarchuk V., Plevachuka Yu., Kaban I., Novakovic R.

Subjects: “…lead-free solders…”
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Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder by Chen W., Kong J., Chen W.J.

Subjects: “…lead-free solders…”
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The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system by Pstruś J.

Subjects: “…lead-free solders…”
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Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling by Ramiro Sebastian Vargas Cruz, Viktor Gonda

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On the synthesis of Bi-based precursors for lead-free solders development by Gandova V., Lilova K., Malakova H., Huber B., Milcheva N., Ipser H., Vrestal J., Vassilev G.

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