The molecular mechanism by which heat stress during the grain filling period inhibits maize grain filling and reduces yield by Xiaohu Li, Shilin Zhuge, Jiyuan Du, Peng Zhang, Xingyu Wang, Tianjian Liu, Donghui Li, Haoran Ma, Xinzheng Li, Yongxin Nie, Changjian Liao, Haiping Ding, Zhiming Zhang

Subjects: Get full text