Pasithea-1: An Energy-Efficient Sequential Reconfigurable Array With CPU-Like Programmability by Tobias Kaiser, Esther Gottschalk, Kai Biethahn, Friedel Gerfers

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Investigation of temperature homogeneity during infrared soldering of silicon solar cells using the finite element method by Joseph Daniel Christopher, De Rose Angela, Eberlein Dirk, Parlayan Onur, Grübel Benjamin, Beinert Andreas J., Neuhaus Holger

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Biomimetic ECM nerve guidance conduit with dynamic 3D interconnected porous network and sustained IGF-1 delivery for enhanced peripheral nerve regeneration and immune modulation by Teng Wan, Qi-Cheng Li, Feng-Shi Zhang, Xiao-Meng Zhang, Na Han, Pei-Xun Zhang

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Networking strategy for wireless chip area network on PCB by Xuehua LI, Yongbin ZHANG, Yiwen Wang

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3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics by Chengjun Zhang, Qing Yang, Haoyu Li, Zexiang Luo, Yu Lu, Jialiang Zhang, Cheng Li, Feng Chen

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FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION by HUA JianWei, HUANG ChunYue, LIANG Ying, HUANG Wei, ZHANG Long

Subjects: “…Optical interconnection…”
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Concurrent Mode-Division Multiplexed Half-Mode Substrate-Integrated Waveguide Link With Three Independent Data Channels by Mohamed Elsawaf, Constantine Sideris

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Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits by Andrzej Kiernich, Jerzy Kalenik, Wojciech Stęplewski, Marek Kościelski, Aneta Chołaj

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Multi-protocol switching circuit for software defined interconnection system by DONG Chunlei, SHEN Jianliang, LI Peijie, WANG Pan, BO Guangming, LU Kai

Subjects: “…software defined interconnection…”
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An evaluation method for power supply guarantee capability of multi-city interconnected power system based on security region by Zhihong Liu, Yunyao Chen, Yaoxia Du, Yang Luo

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Preamble Design and Noncoherent ToA Estimation for Pulse-Based Wireless Networks-on-Chip Communications in the Terahertz Band by Pankaj Singh, Sung-Yoon Jung

Subjects: “…intra-chip wireless interconnect…”
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Linear Quadratic Regulator-Based Coordinated Voltage and Power Control for Flexible Distribution Networks by Zhipeng Jing, Lipo Gao, Chengao Wu, Dong Liang

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Renewable Energy Interconnected Power System Load Frequency Control Under Network Attacks and Communication Time Delay by MI Yang, YANG Zishuai, XU Mingming, ZHOU Jie, HAN Yunhao

Subjects: “…renewable energy interconnected power system|network attacks|communication time delay|event triggering|sliding mode load frequency control…”
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Advanced optical receiver architectures for ultra-high capacity but low-cost short-reach optical interconnects by Honglin JI, Xueyang LI, Zhixue HE, Weisheng HU, Shieh William

Subjects: “…short-reach optical interconnects…”
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Information support of CAD of technological processes of structurally complex product prototypes by A. V. Petukhov

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Substantiation of directions for improving the management mechanism of the construction complex in the Donetsk People’s Republic by A. S. Tarasov

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A Chisel Generator for Standardized 3-D Die-to-Die Interconnects by Harrison Liew, Farhana Sheikh, Jong-Ru Guo, Zuoguo Wu, Borivoje Nikolic

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3D‐Assembled Bionic Tactile Sensing “Skin” for Soft Machines by Ruiping Zhang, Yihao Chen, Ziheng Wang, Ziwei Liang, Yinji Ma, Ying Chen, Xue Feng

Subjects: “…stretchable serpentine interconnection…”
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Impact of Technology Scaling and Back-End-of-the-Line Technology Solutions on Magnetic Random-Access Memories by Piyush Kumar, Da Eun Shim, Siri Narla, Azad Naeemi

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Research and prospect of intelligent connected vehicle test scheme by Dongsheng WU, Fengna LI, Ningxin XIA, Dacheng LI

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