Influence of Electrostatic Interactions on the Self-Assembly of Charged Peptides by Xue Sun, Bolan Wu, Na Li, Bo Liu, Shijun Li, Liang Ma, Hangyu Zhang

Get full text

A Cooperative Coevolutionary Cuckoo Search Algorithm for Optimization Problem by Hongqing Zheng, Yongquan Zhou

Get full text

An AMOLED AC-Biased Pixel Design Compensating the Threshold Voltage and I-R Drop by Ching-Lin Fan, Hui-Lung Lai, Yan-Wei Liu

“…The proposed threshold voltage and I-R drop compensation circuit, which comprised three transistors and one capacitor, have been verified to supply uniform output current by simulation work using the Automatic Integrated Circuit Modeling Simulation Program with Integrated Circuit Emphasis (AIM-SPICE) simulator. …”
Get full text

Superconducting Nanostrip Photon-Number-Resolving Detector as an Unbiased Random Number Generator by Pasquale Ercolano, Mikkel Ejrnaes, Ciro Bruscino, Syed Muhammad Junaid Bukhari, Daniela Salvoni, Chengjun Zhang, Jia Huang, Hao Li, Lixing You, Loredana Parlato, Giovanni Piero Pepe

Get full text

Dimensional control of interface coupling-induced ferromagnetism in CaRuO3/SrCuO2 superlattices by Li Zhe, Shi Wenxiao, Zhang Jine, Zheng Jie, Wang Mengqin, Zhu ZhaoZhao, Han Furong, Zhang Hui, Xie Liming, Yunzhong Chen, Fengxia Hu, Baogen Shen, Yuansha Chen, Jirong Sun

Get full text

Improvement of Mosfet Characteristics by Ranbir Singh

“…By inclusion of a semi-dielectric layer, a novel MOSFET Structure, the T-MOSFET, and its integrated circuit version are presented. Both for the enhancement mode and the depletion mode, equivalent circuit models are developed. …”
Get full text

Improvement in Brightness Uniformity by Compensating for the Threshold Voltages of Both the Driving Thin-Film Transistor and the Organic Light-Emitting Diode for Active-Matrix Orga... by Ching-Lin Fan, Hao-Wei Chen, Hui-Lung Lai, Bo-Liang Guo, Bohr-Ran Huang

“…This paper proposes a novel pixel circuit design and driving method for active-matrix organic light-emitting diode (AM-OLED) displays that use low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) as driving element. The automatic integrated circuit modeling simulation program with integrated circuit emphasis (AIM-SPICE) simulator was used to verify that the proposed pixel circuit, which comprises five transistors and one capacitor, can supply uniform output current. …”
Get full text

A Novel LTPS-TFT Pixel Circuit to Compensate the Electronic Degradation for Active-Matrix Organic Light-Emitting Diode Displays by Ching-Lin Fan, Fan-Ping Tseng, Hui-Lung Lai, Bo-Jhang Sun, Kuang-Chi Chao, Yi-Chiung Chen

“…The proposed compensation pixel circuit is driven by voltage programming scheme, which is composed of five TFTs and one capacitor, and has been certified to provide uniform output current by the Automatic Integrated Circuit Modeling Simulation Program with Integrated Circuit Emphasis (AIM-SPICE) simulator. …”
Get full text

Multi-Channel PWM Heater Control Chip in 0.18 μm High-Voltage CMOS for a Quantum Simulator by Christoph Ribisch, Michael Hofbauer, Kerstin Schneider-Hornstein, Alexander Kuttner, Martin Jungwirth, Horst Zimmermann

“…The chip also includes transimpedance amplifiers (TIAs) to monitor light powers inside the photonic integrated circuit (PIC) of the quantum simulator. 40 PWM channels and eight TIA channels are monolithically implemented in an application-specific integrated circuit (ASIC) using a 0.18 μm high-voltage CMOS technology. …”
Get full text

Device Modeling Based on Cost-Sensitive Densely Connected Deep Neural Networks by Xiaoying Tang, Zhiqiang Li, Lang Zeng, Hongwei Zhou, Xiaoxu Cheng, Zhenjie Yao

Get full text

RADIATION HARDENED ANALOG IC FOR SENSOR by O. V. Dvornikov, V. L. Diatlov, V. A. Tchekhovski, E. I. Starchenko

“…Problems of specialized analog integrated circuit design for sensor equipments are considered. …”
Get full text

Using Spice Circuit Simulation Program in Reliability Analysis of Redundant Systems with Non-Repairable Units and Common-Cause Failures by Muhammad Taher Abuelma'atti, Isa Salman Qamber

“…The effectiveness of Simulation Program with Integrated Circuit Emphasis (SPICE) in calculating probabilities, reliability, steady-state availability and mean-time to failure of redundant systems with non-repairable units and common-cause failures described by Markov models is demonstrated. …”
Get full text

Nanoscale ultrafast dynamics in Bi2Te3 thin film by terahertz scanning near-field nanoscopy by Ziyu Huang, Jing Li, Peiyan Li, Lin Du, Mingcong Dai, Jiahua Cai, Zejun Ren, Tianxiao Nie, Xiaojun Wu

Get full text

Wafer-Level Characterization and Monitoring Platform for Single-Photon Avalanche Diodes by Samuel Parent, Frederic Vachon, Valerie Gauthier, Steve Lamoureux, Alexandre Paquette, Jacob Deschamps, Tommy Rossignol, Nicolas Roy, Philippe Arsenault, Henri Dautet, Serge A. Charlebois, Jean-Francois Pratte

“…The platform relies on a dedicated integrated circuit made in a standard CMOS technology and used in different configurations from a prototype printed circuit board (die-level testing) to active probe cards (wafer-level mapping). …”
Get full text

Characteristics and Breakdown Behaviors of Polysilicon Resistors for High Voltage Applications by Xiao-Yu Tang, Ke Dong

“…With the rapid development of the power integrated circuit technology, polysilicon resistors have been widely used not only in traditional CMOS circuits, but also in the high voltage applications. …”
Get full text

W-Band GaAs pHEMT Power Amplifier MMIC Stabilized Using Network Determinant Function by Seong-Hee Han, Dong-Wook Kim

“…This paper presents a W-band power amplifier monolithic microwave integrated circuit (MMIC) that is designed for high-precision millimeter-wave systems and fabricated using a 0.1 µm GaAs pHEMT process. …”
Get full text

Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding by Wuwei Feng, Xin Chen, Cuizhu Wang, Yuzhou Shi

“…Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds. …”
Get full text

The application of organic materials used in IC advanced packaging:A review by Liu Jikang

“…To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced packaging technologies have been developed, which including flip chip (FC), bumping, fan-in wafer level packaging (FIWLP), fan-out wafer level packaging (FOWLP), 2.5D packaging (interposer), CMOS image sensor through silicon via (CIS-TSV), fan-out panel level packaging (FOPLP) and so on. …”
Get full text

Fuzzy TOPSIS for Multiresponse Quality Problems in Wafer Fabrication Processes by Chiun-Ming Liu, Mei-Yu Ji, Wen-Chieh Chuang

“…In this study, the fuzzy technique for order preference by similarity to an ideal solution (TOPSIS), one of the fuzzy multiattribute decision-analysis (MADA) methods, is proposed to investigate the fuzzy multiresponse quality problem in integrated-circuit (IC) wafer fabrication process. The fuzzy TOPSIS is one of the effective fuzzy MADA methods for dealing with decision-making problems under uncertain environments. …”
Get full text

Comparison of Photonic to Plasmonic Mode Converters for Plasmonic Multiple-Input Devices by Samantha Lubaba Noor, Francky Catthoor, Dennis Lin, Pol Van Dorpe, Azad Naeemi

“…Implementing a compact optical integrated circuit by utilizing subwavelength plasmonic devices requires the design of compact and efficient photonic to plasmonic mode converters. …”
Get full text