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  1. 1
    Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology

    Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology by Junhao Du, Xuewei Zhao, Jiale Su, Ben Li, Xiangliang Duan, Tianyu Dong, Hongxiao Lin, Yuhui Ren, Yuanhao Miao, Henry H. Radamson

    Published 2025-01-01
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  2. 2
    A Nonintrusive Nonlinear Model Reduction Method for Thermal Cycling-Induced Viscoplastic Deformation Problems Based on Segmented Gaussian Process Regression Machine Learning

    A Nonintrusive Nonlinear Model Reduction Method for Thermal Cycling-Induced Viscoplastic Deformation Problems Based on Segmented Gaussian Process Regression Machine Learning by Jiunn-Horng Lee, Chia-Hsiu Ou, Chih-Min Yao, Ming-Hsiao Lee

    Published 2025-01-01
    Subjects: “…Flip chip package…”
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