Experimental investigation of mechanical behavior of horseshoe-shaped segmental tunnel linings by Xufeng Ai, Wenge Qiu, Jihui Chen, Partab Rai, Yuchao Zheng, Hui Hu

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Enhancing Reliability in Embedded Systems Hardware: A Literature Survey by Ryan Aalund, Vincent Philip Paglioni

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Micro failure analysis of adhesively bonded joints enhanced with natural cork particles: Impact of overlap length and particles volume fraction by Alireza Akhavan-Safar, Ana Queirs Barbosa, Lucas Filipe Martins da Silva, Majid Reza Ayatollahi

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Fatigue failure mechanisms and life prediction of additive manufactured metallic lattices: a comprehensive review by Hao Xin, Dingcheng Tang, Linwei Dang, Lei Gao, Zhenyu Yang, Bin Wu, Xiaofan He, Zhixin Zhan

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Mechanical properties and macro–micro failure mechanisms of granite under thermal treatment and inclination by Yue Cao, Xiaowu Zhang, Lei Sun, Yadong Zheng, Chong Li

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Electronics packaging materials and component-level degradation monitoring by Adwait Inamdar, Willem D. Van Driel, GuoQi Zhang

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Design of adhesively-bonded single lap joints for automotive applications under compressive loading by Ferhat Kadioglu, Murat Demiral

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Short-Circuit Performance Analysis of Commercial 1.7 kV SiC MOSFETs Under Varying Electrical Stress by Shahid Makhdoom, Na Ren, Ce Wang, Yiding Wu, Hongyi Xu, Jiakun Wang, Kuang Sheng

Subjects: “…failure mechanisms…”
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