Gamma Irradiation Effects on Track Properties of PADC-American Acrylics Track Detector by Dipak Sinha

“…At a higher etching temperature of 70ºC, the etch rates ratio becomes almost equal for post gamma exposed detector. …”
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Preparation of Au-Ag Bimetals and Large-Size Porous Gold Nanostructured Materials by Xuewen Chen

“…Due to the deficiency of conventional etching agents, the “regrowth etching” method was proposed in this study. …”
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Performance of InGaN Light-Emitting Diodes Fabricated on Patterned Sapphire Substrates with Modified Top-Tip Cone Shapes by Hsu-Hung Hsueh, Sin-Liang Ou, Chiao-Yang Cheng, Dong-Sing Wuu, Ray-Hua Horng

“…To enhance the crystal quality of the GaN epilayer and the optoelectronic performance of the LED device, the top-tip cone shapes of the PSSs were further modified using wet etching. Through the wet etching treatment, some dry-etched induced damage on the substrate surface formed in the PSS fabrication process can be removed to achieve a high epilayer quality. …”
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Wet-Chemical Surface Texturing of Sputter-Deposited ZnO:Al Films as Front Electrode for Thin-Film Silicon Solar Cells by Xia Yan, Selvaraj Venkataraj, Armin G. Aberle

“…In the two-step process, the second etching step further enhances the optical haze, while simultaneously improving the uniformity of the texture features created by the HCl etch. …”
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Enhanced Temperature Control Method Using ANFIS with FPGA by Chiung-Wei Huang, Shing-Tai Pan, Jun-Tin Zhou, Cheng-Yuan Chang

“…Temperature control in etching process is important for semiconductor manufacturing technology. …”
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Design of a novel sextuple band-notched UWB antenna by Han LIU, Cheng-you YIN, Qi-meng FAN

“…Sextuple band-notched characteristics could be realized by adding a T-shaped stub, a bent stub, and etching a U-shaped slot on the patch, adding a C-shaped stub, an anti-C shaped stub near microstrip line and etching a pair of L-shaped slots on the ground plane,which effectively sup-presses the interference between narrow band systems and UWB systems. …”
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Superior Antireflection Coating for a Silicon Cell with a Micronanohybrid Structure by Hsi-Chien Liu, Gou-Jen Wang

“…The processing time for the etching on an N-type high-resistance (NH) silicon wafer can be controlled to around 5 min. …”
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Formation and structural studies of integrated membranes based on channel silicon by V. V. Bolotov, K. E. Ivlev, E. V. Knyazev, I. V. Ponomareva

“…For the electrolyte based on HF: (CH3 )2CO, the duration of etching may be longer, which is associated with a higher solubility of hydrogen in acetone than isopropanol. …”
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Technological dental sealants: in vitro evaluation of material properties and antibiofilm potential by Witalo Pereira de Jesus, Luiza de Almeida Queiroz Ferreira, Washington Henrique Themoteo da Silva, Fernanda Vieira Belém, Ana Paula Turrioni, Cláudia Silami de Magalhães, Mila Fernandes Moreira Madeira, Ivana Márcia Alves Diniz, Marco Aurelio Benini Paschoal

“…Methods The following groups were analyzed: Beautisealant® self-etching sealant (Shofu)(G1), FluroShield® conventional sealant (Dentsply)(G2- Control Group), Flow Constic® self-adhesive/self-etching resin (DMG)(G3) and Beautifil Flow Plus F03® conventional resin (Shofu)(G4). …”
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Influence of Surface Morphology on the Effective Lifetime and Performance of Silicon Heterojunction Solar Cell by Shui-Yang Lien, Yun-Shao Cho, Yan Shao, Chia-Hsun Hsu, Chia-Chi Tsou, Wei Yan, Pin Han, Dong-Sing Wuu

“…Different etching times are used to etch silicon wafers. Effects of surface morphology on wafer minority carrier lifetime, passivation quality, and heterojunction solar cell (HJ) performance are investigated. …”
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The shear bond measurement of two self-adhesive composite resins to both enamel and dentin (An in vitro study) by Abdulkareem Ramadhan Ibrahim

“…Thirty enamel samples were divided into three groups; group E1: Vertise Flow, group E2: Constic and group E3: conventional composite with self-etching bonding. Also the thirty dentin groups were divided into three groups, group D1, D2 and D3 with the same corresponding composites as in enamel groups. …”
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Numerical Simulation on Hydrofracture Propagation in Fractured-Vuggy Unconventional Reservoirs by Tingxue Jiang, Haitao Wang, Xiaobing Bian, Daobing Wang, Jun Zhou, Bo Yu

“…When a large pressure drop occurs, it is suggested that the middle-low viscosity acid be injected at a low rate to etch the carbonate rock and enhance the fracture conductivity. …”
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An Economical Modification Method for MIL-101 to Capture Radioiodine Gaseous: Adsorption Properties and Enhancement Mechanism by Peng Wang, Bing-Bing Qi, Ao-Tian Gu, Kai-Wei Chen, Chun-Hui Gong, Yang Yi

“…The iodine adsorption experiment of etched MIL-101 with different etching time (1 h, 3 h, 4 h, and 6 h) was completed, the results show that the optimal etching time is 4 hours and the capture capacity of the etched MIL-101 is 371 wt%, which is about 22% higher than that of original MIL-101. …”
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Preparation of Bioactive Titanium Surfaces via Fluoride and Fibronectin Retention by Carlos Nelson Elias, Patricia Abdo Gravina, Costa e Silva Filho, Pedro Augusto de Paula Nascente

“…Two titanium dental implants (Porous-acid etching and PorousNano-acid etching followed by fluoride ion modification) were characterized by high-resolution scanning electron microscopy, atomic force microscopy, and X-ray diffraction before and after the incorporation of human plasma fibronectin (FN). …”
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Optical Fresnel zone plate flat lenses made entirely of colored photoresist through an i-line stepper by Ryohei Yamada, Hiroyuki Kishida, Tomohiro Takami, Itti Rittaporn, Mizuho Matoba, Haruyuki Sakurai, Kuniaki Konishi

“…However, their fabrication, particularly for visible wavelengths, involves complex and costly processes, such as high-resolution lithography and dry-etching, which has limited their availability. In this study, we present a simplified method for fabricating visible Fresnel zone plate (FZP) planar lenses, a type of diffractive optical element, using an i-line stepper and a special photoresist (color resist) that only necessitates coating, exposure, and development, eliminating the need for etching or other post-processing steps. …”
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Surface Texturing with Hemispherical Cavities to Improve Efficiency in Silicon Solar Cells by D. W. de Lima Monteiro, F. P. Honorato, R. F. de Oliveira Costa, L. P. Salles

“…The method relies on anisotropic etching of bulk silicon and requires only a single oxide mask and two etching steps with a KOH or TMAH aqueous solution. …”
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Fabrication of Hollow Needle Tips with Nanoholes by Plasma Maskless Processing and Calculation and Detection of Complex Surface Edges by Zuocai Dai, Sha Zhou, Tongguang Yang, Yanpeng Wang

“…The plasma maskless processing method combines the advantages of plasma etching and scanning probe processing, such as high etching efficiency, wide range of applicable materials, and high resolution. …”
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Influence of chlorhexidine dentin disinfection on universal adhesive performance: Interfacial adaptation and bond strength assessments. by Alaa Turkistani, Helal M Sonbul, Mai Almarzouki

“…<h4>Purpose</h4>This study aimed to investigate the effect of chlorhexidine (CHX) cavity disinfectant on interfacial microleakage and micro-tensile bond strength (μTBS) of a universal adhesive bonded to dentin in both self-etch (SE) and etch-and-rinse (ER) modes.<h4>Methods</h4>Class I cavities were prepared in the coronal dentin of extracted human teeth and assigned to two etching modes (SE or ER), then subdivided by disinfection with or without CHX (n = 5). …”
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High-precision multi-focus laser sculpting of microstructured glass by Kang Xu, Peilin Huang, Lingyu Huang, Li Yao, Zongyao Li, Jiantao Chen, Li Zhang, Shaolin Xu

“…The multi-focus laser modification in tandem with chemical etching enables the fabrication of glass microstructures with highly adjustable profiles. …”
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High-Performance Edge-Contact Monolayer Molybdenum Disulfide Transistors by Jiankun Xiao, Xiong Xiong, Xinhang Shi, Shiyuan Liu, Shenwu Zhu, Yue Zhang, Ru Huang, Yanqing Wu

“…Here, we report high-performance edge-contact monolayer molybdenum disulfide (MoS2) field-effect transistors (FETs) utilizing well-controlled plasma etching techniques. Plasma etching with pure argon improves the edge dangling bonds and thus improves the edge-contact quality. …”
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