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  1. 41

    Physicochemical properties of water quality of Imeh, Edegelem and Chokocho communities located along Otamiri-oche River in Etche Ethnic Nationality of Rivers State, Nigeria by BM Onyegeme-Okerenta, C Obia, MO Wegwu

    Published 2016-05-01
    “… Some physiochemical properties of water quality of Otamiri-oche River which runs through Imeh,  Edegelem and Chokocho Communities in Etche ethnic nationality of Rivers State, Nigeria were  investigated. …”
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    Article
  2. 42

    Physicochemical properties of water quality of Imeh, Edegelem and Chokocho communities located along Otamiri-oche River in Etche Ethnic Nationality of Rivers State, Nigeria by BM Onyegeme-Okerenta, C Obia, MO Wegwu

    Published 2016-05-01
    “… Some physiochemical properties of water quality of Otamiri-oche River which runs through Imeh,  Edegelem and Chokocho Communities in Etche ethnic nationality of Rivers State, Nigeria were  investigated. …”
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    Article
  3. 43

    Reading and (not) seeing? by Sandra Saayman

    Published 2016-12-01
    Subjects:
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  4. 44

    Ultra-low reverse leakage NiOx/β-Ga2O3 heterojunction diode achieving breakdown voltage >3 kV with plasma etch field-termination by Yizheng Liu, Saurav Roy, Carl Peterson, Arkka Bhattacharyya, Sriram Krishnamoorthy

    Published 2025-01-01
    “…The heterojunction diodes are fabricated via bilayer NiOx sputtering followed by self-aligned plasma-etching for field-termination on both large (1-mm2) and small area (300/100-μm diameter) devices. …”
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  8. 48

    COMPARATIVE RESEARCHES OF FRACTURES OF HIGH-STRENGTH CAST IRON IN THE AS-CAST AND DEFORMED STATE by A. I. Pokrovsky, I. N. Khrol

    Published 2016-01-01
    Subjects: “…the results of comparative studies of fracture surfaces of high-strength cast iron in the as-cast state and after hot direct extrusion through an aperture of a conical die are presented. the shape change of graphite inclusions and components of the metal matrix is examined with increasing the reduction ratio from 0 (as-cast state) to 80%. for the fist time, using the electrochemical etching of the metal matrix of the cast iron, it is demonstrated experimentally that at plastic deformation the ductile flow of graphite inclusions occurs without fracturing of the latter. the surface morphology of a deformed graphite inclusion is revealed. it is shown that inside the inclusion the strain is distributed non-uniformly: the peripheral zones are deformed to a larger extent while the central part may retain its original radial structure. the fact that the most part of graphite inclusions on the fracture surface of the deformed cast iron appeared undamaged (very small amount of fractured inclusions was observed) testifies against the common opinion that graphite acts as a crack nucleation site. a hypothesis is put forward that the crack nucleates in the metal matrix, presumably at the pearlite/ferrite interface, and propagates from one graphite inclusion to another rounding but not damaging the latter.…”
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  9. 49

    Solar Cells Produced by Diamond Wire Sawn Multicrystalline Silicon Wafer by Using Additive-Assisted Acidic Texturization by Jie Sun, Yan Zuo, Runguang Sun, Lang Zhou

    Published 2022-01-01
    “…A novel additive-assisted acidic etching method is proposed to improve the etched morphology of the diamond wire sawn (DWS)-processed multicrystalline silicon (mc-Si) wafers. …”
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  10. 50

    Effect of Different Surface Treatments on the Micro-Shear Bond Strength and Surface Characteristics of Zirconia: An In Vitro Study by Ann Sales, Shobha J. Rodrigues, M. Mahesh, Kishore Ginjupalli, Thilak Shetty, Umesh Y. Pai, Sharon Saldanha, Puneeth Hegde, Sandipan Mukherjee, Vignesh Kamath, Prashant Bajantri, N. Srikant, Ravindra Kotian

    Published 2022-01-01
    “…The four groups were: control (C), air abrasion with 110 µm Al2O3 particles (A), etching with Zircos–E Etching solution for 2 hours (E), and a combination of air abrasion and etching (AE). …”
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  11. 51

    Influence of Different Enamel Pretreatment on Bond Strength of Fissure Sealant by Dafina Doberdoli, Hrvoje Jurić

    Published 2024-01-01
    “…Group 1: Quantum Square Pulse (QSP); Group 2: Medium-Short Pulse (MSP) mode; Group 3: Super Short Pulse (SSP) mode; Group 4: QSP + acid etching; Group 5: MSP + acid etching; Group 6: SSP + acid etching. …”
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  12. 52

    Gamma Irradiation Effects on Track Properties of PADC-American Acrylics Track Detector by Dipak Sinha

    Published 2012-01-01
    “…At a higher etching temperature of 70ºC, the etch rates ratio becomes almost equal for post gamma exposed detector. …”
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  13. 53

    Preparation of Au-Ag Bimetals and Large-Size Porous Gold Nanostructured Materials by Xuewen Chen

    Published 2021-01-01
    “…Due to the deficiency of conventional etching agents, the “regrowth etching” method was proposed in this study. …”
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  14. 54

    Performance of InGaN Light-Emitting Diodes Fabricated on Patterned Sapphire Substrates with Modified Top-Tip Cone Shapes by Hsu-Hung Hsueh, Sin-Liang Ou, Chiao-Yang Cheng, Dong-Sing Wuu, Ray-Hua Horng

    Published 2014-01-01
    “…To enhance the crystal quality of the GaN epilayer and the optoelectronic performance of the LED device, the top-tip cone shapes of the PSSs were further modified using wet etching. Through the wet etching treatment, some dry-etched induced damage on the substrate surface formed in the PSS fabrication process can be removed to achieve a high epilayer quality. …”
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  15. 55

    Wet-Chemical Surface Texturing of Sputter-Deposited ZnO:Al Films as Front Electrode for Thin-Film Silicon Solar Cells by Xia Yan, Selvaraj Venkataraj, Armin G. Aberle

    Published 2015-01-01
    “…In the two-step process, the second etching step further enhances the optical haze, while simultaneously improving the uniformity of the texture features created by the HCl etch. …”
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  16. 56

    Enhanced Temperature Control Method Using ANFIS with FPGA by Chiung-Wei Huang, Shing-Tai Pan, Jun-Tin Zhou, Cheng-Yuan Chang

    Published 2014-01-01
    “…Temperature control in etching process is important for semiconductor manufacturing technology. …”
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  17. 57

    Superior Antireflection Coating for a Silicon Cell with a Micronanohybrid Structure by Hsi-Chien Liu, Gou-Jen Wang

    Published 2014-01-01
    “…The processing time for the etching on an N-type high-resistance (NH) silicon wafer can be controlled to around 5 min. …”
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  18. 58

    Formation and structural studies of integrated membranes based on channel silicon by V. V. Bolotov, K. E. Ivlev, E. V. Knyazev, I. V. Ponomareva

    Published 2018-07-01
    “…For the electrolyte based on HF: (CH3 )2CO, the duration of etching may be longer, which is associated with a higher solubility of hydrogen in acetone than isopropanol. …”
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  19. 59

    Technological dental sealants: in vitro evaluation of material properties and antibiofilm potential by Witalo Pereira de Jesus, Luiza de Almeida Queiroz Ferreira, Washington Henrique Themoteo da Silva, Fernanda Vieira Belém, Ana Paula Turrioni, Cláudia Silami de Magalhães, Mila Fernandes Moreira Madeira, Ivana Márcia Alves Diniz, Marco Aurelio Benini Paschoal

    Published 2025-02-01
    “…Methods The following groups were analyzed: Beautisealant® self-etching sealant (Shofu)(G1), FluroShield® conventional sealant (Dentsply)(G2- Control Group), Flow Constic® self-adhesive/self-etching resin (DMG)(G3) and Beautifil Flow Plus F03® conventional resin (Shofu)(G4). …”
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  20. 60

    Influence of Surface Morphology on the Effective Lifetime and Performance of Silicon Heterojunction Solar Cell by Shui-Yang Lien, Yun-Shao Cho, Yan Shao, Chia-Hsun Hsu, Chia-Chi Tsou, Wei Yan, Pin Han, Dong-Sing Wuu

    Published 2015-01-01
    “…Different etching times are used to etch silicon wafers. Effects of surface morphology on wafer minority carrier lifetime, passivation quality, and heterojunction solar cell (HJ) performance are investigated. …”
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