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- Physics 1
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361
Enhanced energy storage in relaxor (1-x)Bi0.5Na0.5TiO3-xBaZryTi1-yO3 thin films by morphotropic phase boundary engineering
Published 2025-01-01“…Abstract Perovskites at the crossover between ferroelectric and relaxor are often used to realize dielectric capacitors with high energy and power density and simultaneously good efficiency. …”
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362
Microstructural and Electrical Properties of Sn-Modified BaTiO3 Lead-Free Ceramics by Two-Step Sintering Method
Published 2018-01-01“…At the lower T1 sintering temperature of 1400°C, the dielectric and piezoelectric properties and the Curie temperature of the ceramics were improved significantly by increasing t1 dwell time. …”
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363
Microwave Characterization of Metal Powder in Additive Manufacturing (AM)
Published 2024-01-01“…To assess sensitivity of microwave signals to the properties of metal powder used in AM, different types of metal powder were incorporated into resin composite samples, whose dielectric and magnetic properties were then measured using the well-known completely filled-waveguide technique at the Ka-band (26.5–40 GHz) and V-band (50–67 GHz). …”
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364
An affordable and adaptable Faraday isolator design for research
Published 2025-03-01“…The design consists of a 3D printed mount housing seven permanent neodymium ring magnets, a Terbium Gallium Garnet (TGG) dielectric crystal, and two polarizing beam splitter cubes. …”
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365
Drying Grain Pretreated by Low-Voltage Spark-Discharge Plasma Channel
Published 2024-03-01“…Sample 1 was subjected to direct contact with the electrodes while sample 2 underwent treatment on a dielectric substrate. The control remained untreated. …”
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366
Optical Characterization of Zinc Modified Bismuth Silicate Glasses
Published 2015-01-01“…Optical constants n and k obey k-k consistency and the dielectric response of the studied glass system is similar to that obtained for Classical Electron Theory of Dielectric Materials. …”
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367
Controllable synthesis of nonlayered high-κ Mn3O4 single-crystal thin films for 2D electronics
Published 2025-01-01“…Abstract Two-dimensional (2D) materials have been identified as promising candidates for future electronic devices. However, high dielectric constant (κ) materials, which can be integrated with 2D semiconductors, are still rare. …”
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368
Improvement of Mosfet Characteristics
Published 1990-01-01“…By inclusion of a semi-dielectric layer, a novel MOSFET Structure, the T-MOSFET, and its integrated circuit version are presented. …”
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369
Phase Relations in Ba6−3xLn8+2xTi18O54 (Ln = Nd & Sm) Electroceramics
Published 2013-01-01“…The microwave dielectric properties of the materials are reported in addition to phase characterisation and structural analysis via X-ray diffraction and field emission scanning electron microscopy coupled with energy dispersive X-ray spectroscopy. …”
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370
Salinity and Sugar Content Detection by Wideband Microwave–Based Patch Antenna Sensor
Published 2025-01-01“…This article studies a dielectric microwave sensor to identify salinity and sugar concentration. …”
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371
Processing and Performance of Polymeric Transparent Conductive Composites
Published 2013-01-01“…Dielectric analysis (DEA) was used to probe relaxations in neat PC and BEDO-TTF/PC. …”
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372
Passivation of substrates with hydrogen to reduce the number of electron traps in the buffer layer at the contact of silicon with Ba1-xSrxTiO3
Published 2024-12-01“…High-frequency C–V curves of the metal–dielectric–semiconductor structures with Ba0.8Sr0.2TiO3 insulating layers deposited on both wafers have been measured. …”
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373
Electronic Properties of Ultra‐Wide Bandgap BxAl1−xN Computed from First‐Principles Simulations
Published 2025-01-01“…These alloys are found to exhibit large dielectric breakdown fields in the range 9–35 MV cm−1 with a linear dependence on x. …”
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374
Unidirectional Alleviation of the Diffraction Limit in Geometrically Anisotropic Photonics
Published 2025-01-01“…Herein, we report on the effect of anisotropic geometrical scaling of dielectric photonic crystals to alleviate the diffraction barrier along the Γ → X path of the irreducible Brillouin region. …”
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375
Liquid crystal based tunable terahertz metadevices
Published 2025-01-01“…This review summarizes the research progress in LC based THz metadevices in three different respects: LC planar THz devices, LC integrated metal metasurfaces, and LC integrated dielectric metasurfaces. Various technologies for fabrications of LC microstructures and integrations of LCs with metal or dielectric metasurfaces are presented. …”
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376
Design and Analysis of a Five-Band Polarization-Insensitive Metamaterial Absorber
Published 2020-01-01“…The proposed absorber consists of a three-layer structure of the top metal resonator, intermediate dielectric layer, and bottom metal plane. The top structure takes the centroid as the center and spreads out in a three-pronged shape with an average of 360°, and the ends bifurcate again. …”
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377
Intervalence plasmons in boron-doped diamond
Published 2025-01-01“…The measured spectra are subsequently reproduced by first-principles calculations based on the contribution of intervalence band transitions to the dielectric function. Our calculations also reveal that the real part of the dielectric function exhibits a crossover characteristic of metallicity. …”
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378
Electric Field Cycling of Physisorbed Antibodies Reduces Biolayer Polarization Dispersion
Published 2025-01-01“…Abstract The electric dipoles of proteins in a biolayer determine their dielectric properties through the polarization density P. …”
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379
A Study on Material Removal Rate in Powder-Mixed Electro-Discharge Machining Utilizing Integrated Experimental and Computational Fluid Dynamics Analysis
Published 2024-12-01“…Furthermore, the study ventures into the realm of computational fluid dynamics (CFD) to simulate and analyze the intricate dynamics of dielectric flow, powder particle behavior, and debris movement within the inter-electrode gap (IEG). …”
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380
Boosting non-oxide interfacial Co/SiO2 hybrid bonding by selective surface activation
Published 2025-01-01“…This research paves the way for fine-tuning bonding surfaces using a material-selective strategy, which should advance metal/dielectric hybrid bonding for future integration applications.…”
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