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    Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance

    Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance by Tomas Melus, Roman Kolenak, Jaromir Drapala, Mikulas Sloboda, Peter Gogola, Matej Pasak

    Published 2024-10-01
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