Showing 41 - 60 results of 1,218 for search '"copper"', query time: 0.06s Refine Results
  1. 41

    Copper halide-based semiconductor materials. Adsorption properties by I. A. Kirovskaya, L. V. Novgorodtseva, E. P. Surovoi, A. V. Yureva, V. E. Surovaya, L. V. Kolesnikov, V. B. Goncharov, O. V. Kropotin

    Published 2019-06-01
    “…The ion-radical (relating to hydrogen) and donor-acceptor (relating to acetone, isopropyl alcohol) adsorption mechanisms with the participation of coordination-unsaturated atoms (mainly copper atoms) and structural defects as active sites have been established. …”
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    PROBLEMS OF METALLOGRAPHIC DEFINITION OF OXYGEN QUANTITY IN THE DEFORMED COPPER by A. G. Anisovich

    Published 2014-01-01
    “…Determination of oxygen amount in the deformed copper by methods of stereometric metallography is considered. …”
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    Effects of copper and zinc on proteoglycan metabolism in articular cartilage by M. Pasqualicchio, R. Gasperini, G. P. Velo, M. E. Davies

    Published 1996-01-01
    “…In this study the effects of copper and zinc on (i) PG synthesis by cartilage and (ii) synovial-induced PG depletion have been investigated. …”
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  8. 48

    Evaluating the impacts of large-scale opencast copper mining on vegetation productivity change in recent thirty years: a case study of Dexing Copper Mine by Duan Huang, Zhiping Chen, Hengkai Li, Hong Chi, Ming Liao

    Published 2025-12-01
    “…Using the simple non-iterative clustering (SNIC) and random forest (RF) methods, we mapped the Dexing Copper Mine (DCM) at a 30 m spatial resolution with Landsat data from 1991 to 2022. …”
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  9. 49

    Genotoxicity of Copper and Nickel Nanoparticles in Somatic Cells of Drosophila melanogaster by Erico R. Carmona, Alba García-Rodríguez, Ricard Marcos

    Published 2018-01-01
    “…Copper and nickel nanoparticles (Cu-NPs and Ni-NPs, respectively) are used in a variety of industrial applications, such as semiconductors, catalysts, sensors, and antimicrobial agents. …”
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    Effect of Lithium Ions on Copper Nanoparticle Size, Shape, and Distribution by Kyung-Deok Jang, Ada Ortega, Justin Ucol, Hao Du, Nam-Soo Kim

    Published 2012-01-01
    “…In this study, the conventional approach of increasing particle size by the concentration of copper ions and PGPPE in a copper chloride solution was compared to increasing the concentration of lithium chloride when the copper chloride concentration was held constant. …”
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  14. 54

    Photocatalytic Surface Modification of PI Film for Electroless Copper Plating by Wenxia Zhao, Zenglin Wang, Liang Qiao, Shiwei Liu, Hongjian Zhao, Yani Yan

    Published 2018-01-01
    “…The results indicated that, after surface modification under the optimal photocatalytic conditions, the surface contact angle of the PI film decreased from 84.4° to 38.8°, and the adhesion strength between the PI film and the electroless copper film reached 0.78 kN/m. X-ray photoelectron spectroscopy analysis further demonstrated that carboxyl groups formed on the surface of the PI film after photocatalytic treatment. …”
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    Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper by Lung-Chuan Tsao, Cheng-Kai Li, Yu-Kai Sun, Shih-Ying Chang, Tung-Han Chuang

    Published 2021-01-01
    “…Due to the combined advantages of low cost, good soldering properties, and appropriate melting temperature range, novel Sn8Zn3Bi1Mg active solder was developed for direct soldering of transparent conductive oxide (TCO) ceramic targets with oxygen-free copper at 200°C in air. The TCO specimens have aluminum-doped zinc oxide (AZO) and zinc oxide (ZnO) ceramics. …”
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