Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers by Detlef Billep, Jan Mehner, Alexey Shaporin, Klaus Vogel, Dirk Wuensch, Maik Wiemer

Subjects: “…Compliance method…”
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Research of the Dynamic Response Characteristic of Transmission System based on Dynamic Meshing Stiffness by Zhang Gaofeng, You Qiangqiang, Wang Wen

Subjects: “…Dynamic compliance method…”
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Damage accumulation near the cold-expanded hole due to high-cycle fatigue by crack compliance method by Yu. G. Matvienko, S. I. Eleonsky, V.S. Pisarev, M.D Zajtsev

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Determination of fracture mechanics parameters on a base of local displacement measurements by Yu. G. Matvienko, V.S. Pisarev, S. I. Eleonsky

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EXPERIMENTAL RESEARCH OF FRACTURE TOUGHNESS ON NEW ROTOR STEEL FW2 AT ELEVATED TEMPERATURE by WU HaiLi, SUN LinGen

Subjects: “…Elastic unloading compliance method…”
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Research on airborne electronic hardware circuit board level certification strategy by LIU Runzhou, ZHU Hongli, MA Limin

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Airworthiness Compliance Methods for Low-Cost Wet Composite Structures in General Aviation Aircraft by Xiuzhi Liu, Shuang Zheng, Fengtian Yang

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