Comparative study of electro‐thermal characteristics of 4500 V diffusion‐CS IGBT and buried‐CS IGBT by Rui Jin, Yaohua Wang, Li Li, Longlai Xu, Kui Pu, Jun Zeng, Mohamed Darwish

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Deformation-aware design of flexible strained-SiGe channel TFTs by C. K. Maiti, Taraprasanna Dash

“…Abstract In this study, we present a novel deformation-aware predictive modeling and design process for flexible electronic applications of strained-SiGe channel thin-film transistors using a 3D Technology CAD simulation framework. The mechanical deformation-aware design goes beyond traditional transistor design by considering the dynamic behavior of materials and structures under different bending circumstances. …”
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Editorial by Pedro Soares Neves

“…We remind that AIS Journal is focused on the image production realms that are connected with Architecture and Design, among others architectural and design photography, 2D and 3D drawing technologies (CAD) project and inspirational illustration. …”
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