The designation of solid state drive circuit based on SiP technology by Yang Chuwei, Zhang Meijuan, Shen Qing

Subjects: “…system in package （sip）…”
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Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation by Ting-Yu Lee, Yu-Li Chen, Sheng-Jye Hwang, Chun-Yu Ko, Wei-Lun Cheng

Subjects: “…System-in-package…”
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Time-Domain ADC and Security Co-Design for SiP-Based Wireless SAW Sensor Readers by Zhen Mao, Bing Li, Linning Peng, Jinghe Wei

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A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package by Wang Lu, Bai Han, Zeng Yanping, Ding Taojie

Subjects: “…system-in-package…”
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Ceramic based 3D integration technology of integrated navigation microsystem by Shen Shijun, He Yilei, Wang Jinhua, Zhuang Yonghe

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Design of RF front-end system-in-package module based on organic substrate process by Shouwei Chen, Yubo Wu, Xingpeng Liu, Dawen Xia

Subjects: “…3-D system in package (SIP)…”
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Reliability analysis based on cascaded-Foster thermal networks for systems-in-package (SiP) by Djallel Eddine Touati, Aziz Oukaira, Mohamed Ali, Ahmad Hassan, Yvon Savaria, Ahmed Lakhssassi

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Characteristics and Mechanisms of Single Event Effects Caused by Atmospheric Neutrons in System in Package Device by YE Jiefeng1, 2, LIANG Chaohui2, ZHANG Zhangang2, ZHENG Shunshun1, 2, LEI Zhifeng2, LIU Zhili3, GENG Gaoying3, HAN Hui1

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Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies by Djallel Eddine Touati, Aziz Oukaira, Ahmad Hassan, Mohamed Ali, Yvon Savaria, Ahmed Lakhssassi

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Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre by How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien

Subjects: “…micro-electro-mechanical system (MEMS) packaging…”
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