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    Effect of Process Pressure on the Properties of Cu<sub>2</sub>O Thin Films Deposited by RF Magnetron Sputtering

    Effect of Process Pressure on the Properties of Cu<sub>2</sub>O Thin Films Deposited by RF Magnetron Sputtering by Junghwan Park, Chang-Sik Son, Young-Guk Son, Donghyun Hwang

    Published 2024-12-01
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